Invention Application
- Patent Title: POLISHING MECHANISM FOR VEHICLE BUMPER
- Patent Title (中): 车辆抛光机构
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Application No.: US09734166Application Date: 2000-12-12
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Publication No.: US20020072303A1Publication Date: 2002-06-13
- Inventor: Jeng-Gang Chern , Shih-Chien Chiang , Kuang-Ying Lu
- Main IPC: B24B053/02
- IPC: B24B053/02

Abstract:
A polishing mechanism for treating a vehicle bumper incorporating with a multi-shaft robot is disclosed. A polishing wheel is rotationally attached to an end of the robot. A rotational positioning device is provided for positioning the bumper in a position within a working range of the robot. The positioning device includes a pair of racks, a main shaft rotationally arranged between the racks and capable of being positioned to a desired angle, a carrying rack arranged on the main shaft, and a plurality of holding devices arranged on the carrying rack for fixedly holding the bumper in position. A detecting device is provided for checking the worn-out of the polishing wheel for adjusting an optimum distance between the polishing wheel and the bumper. The assembly further includes a piloting gauge attached to the robot for determining an appropriate distance between the polishing wheel and the bumper.
Public/Granted literature
- US06398622B1 Polishing mechanism for vehicle bumper Public/Granted day:2002-06-04
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