公开(公告)号：US20020072303A1

公开(公告)日：2002-06-13

申请号：US09734166

申请日：2000-12-12

Inventor： Jeng-Gang Chern ,  Shih-Chien Chiang ,  Kuang-Ying Lu

IPC: B24B053/02

CPC classification number: B24B19/265 ,  B23Q7/02 ,  B23Q17/09 ,  B23Q17/2233 ,  B24B29/02 ,  B24B49/02 ,  B24B55/06 ,  B25J11/0065 ,  B25J15/0491

Abstract: A polishing mechanism for treating a vehicle bumper incorporating with a multi-shaft robot is disclosed. A polishing wheel is rotationally attached to an end of the robot. A rotational positioning device is provided for positioning the bumper in a position within a working range of the robot. The positioning device includes a pair of racks, a main shaft rotationally arranged between the racks and capable of being positioned to a desired angle, a carrying rack arranged on the main shaft, and a plurality of holding devices arranged on the carrying rack for fixedly holding the bumper in position. A detecting device is provided for checking the worn-out of the polishing wheel for adjusting an optimum distance between the polishing wheel and the bumper. The assembly further includes a piloting gauge attached to the robot for determining an appropriate distance between the polishing wheel and the bumper.

Abstract translation: 公开了一种用于处理结合有多轴机器人的车辆保险杠的抛光机构。 抛光轮被旋转地附接到机器人的端部。 提供了一种旋转定位装置，用于将保险杠定位在机器人的工作范围内的位置。 该定位装置包括一对机架，主轴旋转地布置在机架之间并且能够定位成所需的角度，布置在主轴上的承载架，以及多个保持装置，其布置在承载架上用于固定 保险杠在位。 提供检测装置，用于检查抛光轮的磨损，以调整抛光轮和保险杠之间的最佳距离。 组件还包括附接到机器人的引导表，用于确定抛光轮和保险杠之间的适当距离。

公开(公告)号：US20010006874A1

公开(公告)日：2001-07-05

申请号：US09782914

申请日：2001-02-13

Inventor： Scott E. Moore

IPC: B24B049/05 ,  B24B053/02 ,  B24B053/095 ,  B24B053/12

CPC classification number: B24B53/017 ,  B24B49/006 ,  B24B49/16 ,  B24B53/12

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

公开(公告)号：US20010006870A1

公开(公告)日：2001-07-05

申请号：US09782892

申请日：2001-02-13

Inventor： Scott E. Moore

IPC: B24B049/05 ,  B24B053/02 ,  B24B053/12

CPC classification number: B24B53/017 ,  B24B49/006 ,  B24B49/16 ,  B24B53/12

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract translation: 用于调节和监测用于平坦化微电子衬底的平面化介质的方法和装置。 在一个实施例中，该装置可以包括具有调节表面的调节主体，调节表面接合平坦化介质的平坦化表面并且可相对于平坦化介质移动。 力传感器耦合到调理体，以在调节体和平坦化介质相对于彼此移动时，通过平坦化介质检测施加到调理体的摩擦力。 该装置还可以包括控制调节体和平坦化介质之间的运动，位置或力的反馈装置，以控制平坦化介质的调理。