Invention Application
- Patent Title: Fabrication method for an electrostatographic member having a virtual flexible seamless substrate (subtantially seamless electrostatographic member fabrication method with interlock)
- Patent Title (中): 具有虚拟柔性无缝基板的电子部件的制造方法（具有互锁的基本无缝的静电成像制造方法）
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Application No.: US09683329Application Date: 2001-12-14
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Publication No.: US20020074082A1Publication Date: 2002-06-20
- Inventor: Robert C.U. Yu , Anthony M. Horgan , Satchidanand Mishra , Donald C. Von Hoene , Bing R. Hsieh , Edward F. Grabowski , Richard L. Post , Kathleen M. Carmichael
- Applicant: Xerox Corporation
- Applicant Address: US CT Stamford
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Stamford
- Main IPC: G03G015/24
- IPC: G03G015/24
Abstract:
A seamless flexible electrostatographic imaging member belt fabrication method comprising providing a flexible substrate support sheet, such as with a rectangular shape, placing a template on the support sheet, producing first desired features on a first portion of the substrate support sheet, including removing material from the substrate support sheet with first emissions, producing second desired features on a second portion of the substrate support sheet complementary to the first desired features, including removing material from the substrate support sheet with second emissions, overlapping the first and second desired features, bonding the first desired pattern with the second desired pattern to produce a seamed substrate support belt having substantially no added seam thickness and applying at least one coating over the substrate support belt.
Information query
