Invention Application
- Patent Title: PROCESS FOR REMOVING CHEMICAL MECHANICAL POLISHING RESIDUAL SLURRY
- Patent Title (中): 去除化学机械抛光残留浆料的方法
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Application No.: US09755267Application Date: 2001-01-05
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Publication No.: US20020088477A1Publication Date: 2002-07-11
- Inventor: John Michael Cotte , Donald J. Delehanty , Kenneth John McCullough , Wayne Martin Moreau , John P. Simons , Charles J. Taft , Richard P. Volant
- Applicant: International Business Machines Corporation
- Applicant Address: null
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: null
- Main IPC: C23G001/00
- IPC: C23G001/00 ; C03C023/00 ; C23G001/02 ; B08B009/00 ; B08B003/00 ; B08B003/14 ; B08B007/00 ; C11D001/00
Abstract:
A process of removing residual slurry resulting from chemical mechanical polishing of a workpiece in which the workpiece is contacted with a composition of a supercritical fluid, said supercritical fluid including supercritical carbon dioxide and a co-solvent, and a surfactant.
Public/Granted literature
- US06425956B1 Process for removing chemical mechanical polishing residual slurry Public/Granted day:2002-07-30
Information query
