Invention Application
US20020110758A1 Method of making low cost integrated out-of-plane micro-device structures 有权
制造低成本集成外部平面微器件结构的方法

Method of making low cost integrated out-of-plane micro-device structures
Abstract:
Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. Structures and methods for adjusting the coil diameter after spring release, if necessary, are also disclosed. In one method the radius of curvature of the released elastic members is controlled by depositing a layer of a reflow material and reflowing the layer after release. The high yield structures may be used in numerous electronic applications such as filter circuits.
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