Invention Application
US20020110758A1 Method of making low cost integrated out-of-plane micro-device structures
有权
制造低成本集成外部平面微器件结构的方法
- Patent Title: Method of making low cost integrated out-of-plane micro-device structures
- Patent Title (中): 制造低成本集成外部平面微器件结构的方法
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Application No.: US09780165Application Date: 2001-02-09
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Publication No.: US20020110758A1Publication Date: 2002-08-15
- Inventor: David K. Fork , Christopher L. Chua
- Applicant: Xerox Corporation
- Applicant Address: null
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: null
- Main IPC: G03C005/00
- IPC: G03C005/00

Abstract:
Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. Structures and methods for adjusting the coil diameter after spring release, if necessary, are also disclosed. In one method the radius of curvature of the released elastic members is controlled by depositing a layer of a reflow material and reflowing the layer after release. The high yield structures may be used in numerous electronic applications such as filter circuits.
Public/Granted literature
- US06534249B2 Method of making low cost integrated out-of-plane micro-device structures Public/Granted day:2003-03-18
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