Invention Application
- Patent Title: Punching apparatus for stamping and method for producing the same
- Patent Title (中): 冲压冲压装置及其制造方法
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Application No.: US10143370Application Date: 2002-05-10
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Publication No.: US20020129677A1Publication Date: 2002-09-19
- Inventor: Hiroyuki Tsuji , Kazumasa Kitamura , Motoo Noritake , Satoshi Matsubayashi , Shusaku Kabe
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya-City
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya-City
- Priority: JP10-271329 19980925
- Main IPC: B21K021/00
- IPC: B21K021/00 ; B26F001/14

Abstract:
A stamping punch of a punching apparatus including a grip member provided with crosspieces formed between long grooves on side walls of a rectangular parallelepiped, and a plurality of punch members which are formed integrally with the grip member. The respective punch members are arranged in parallel to one another. A plurality of holes are defined on a punch holder. A large amount of adhesive is contained in the gap between joining surfaces when the grip members of the stamping punches are inserted and secured into the respective holes. Accordingly, the positional accuracy of the punch member is improved, the accuracy of the hole defined through a workpiece is improved, and it is possible to eliminate any fear of occurrence of defect in shape. Further, the rigidity of the punch member can be improved, the stripper is prevented from application of unbalanced load, and the punch is easily exchangeable.
Information query