Invention Application
- Patent Title: Method for integrated circuit packaging
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Application No.: US09829208Application Date: 2001-04-09
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Publication No.: US20020145181A1Publication Date: 2002-10-10
- Inventor: Ronald D. Myer , David J. Post , Bradley R. Knigga , Paul C. Staab
- Applicant: DELPHI TECHNOLOGIES, INC.
- Applicant Address: US MI TROY
- Assignee: DELPHI TECHNOLOGIES, INC.
- Current Assignee: DELPHI TECHNOLOGIES, INC.
- Current Assignee Address: US MI TROY
- Main IPC: H01L023/495
- IPC: H01L023/495
Abstract:
A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in savings from the removal of more expensive batch processing steps.
Public/Granted literature
- US06472251B1 Method for integrated circuit packaging Public/Granted day:2002-10-29
Information query
