Invention Application
US20020149023A1 Structure and method for fabricating III-V nitride devices utilizing the formation of a compliant substrate 审中-公开
利用形成顺应性衬底来制造III-V族氮化物器件的结构和方法

  • Patent Title: Structure and method for fabricating III-V nitride devices utilizing the formation of a compliant substrate
  • Patent Title (中): 利用形成顺应性衬底来制造III-V族氮化物器件的结构和方法
  • Application No.: US10161743
    Application Date: 2002-06-05
  • Publication No.: US20020149023A1
    Publication Date: 2002-10-17
  • Inventor: Lyndee L. HiltJamal Ramdani
  • Applicant: MOTOROLA, INC.
  • Applicant Address: US IL Schaumburg
  • Assignee: MOTOROLA, INC.
  • Current Assignee: MOTOROLA, INC.
  • Current Assignee Address: US IL Schaumburg
  • Main IPC: H01L031/12
  • IPC: H01L031/12
Structure and method for fabricating III-V nitride devices utilizing the formation of a compliant substrate
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer (202) on a silicon substrate (200). The accommodating buffer layer (202) is a layer of monocrystalline material spaced apart from the silicon substrate (200) by an amorphous interface layer (204) of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Utilizing this technique permits the fabrication of semiconductor structures formed by high quality Group III-V nitride films.
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