Invention Application
US20020158643A1 Method and apparatus for generating values for selected pixels used in evaluating semiconductor wafer bumps
审中-公开
用于产生用于评估半导体晶片凸块的所选像素的值的方法和装置
- Patent Title: Method and apparatus for generating values for selected pixels used in evaluating semiconductor wafer bumps
- Patent Title (中): 用于产生用于评估半导体晶片凸块的所选像素的值的方法和装置
-
Application No.: US10047980Application Date: 2002-01-11
-
Publication No.: US20020158643A1Publication Date: 2002-10-31
- Inventor: Leda Villalobos
- Applicant: Electroglas Inc.
- Applicant Address: null
- Assignee: Electroglas Inc.
- Current Assignee: Electroglas Inc.
- Current Assignee Address: null
- Main IPC: G01R031/308
- IPC: G01R031/308
Abstract:
Plural light sources are provided for directing ring patterns of light toward at least one reflective bump formed on and projecting from a first wafer surface of a semiconductor wafer. The intensity of light from the light sources may be varied and may be varied independently of one another. A method and apparatus for adjusting at least one pixel value is also disclosed.
Information query
