Invention Application
US20020162677A1 Process for fabricating a component, such as a capacitor in an integrated circuit, and integrated-circuit component
有权
用于制造组件的方法，例如集成电路中的电容器以及集成电路部件
- Patent Title: Process for fabricating a component, such as a capacitor in an integrated circuit, and integrated-circuit component
- Patent Title (中): 用于制造组件的方法，例如集成电路中的电容器以及集成电路部件
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Application No.: US10136682Application Date: 2002-05-01
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Publication No.: US20020162677A1Publication Date: 2002-11-07
- Inventor: Pascale Mazoyer , Christian Caillat
- Applicant: STMICROELECTRONICS S.A.
- Applicant Address: null
- Assignee: STMICROELECTRONICS S.A.
- Current Assignee: STMICROELECTRONICS S.A.
- Current Assignee Address: null
- Priority: FR0105881 20010502
- Main IPC: H02G003/08
- IPC: H02G003/08
Abstract:
Process for fabricating a component, such as a capacitor in an integrated circuit, and integrated component, in which process and component a first electrode is in the form of a cup; a layer made of a dielectric covers at least the wall of the first electrode; a second electrode fills the cup; a first electrical connection via lies above the second electrode; and a second electrical connection via lies laterally with respect to and at a predetermined distance from the first electrode and is connected to the first electrode.
Public/Granted literature
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