Invention Application
- Patent Title: Semiconductor wafer processing apparatus
- Patent Title (中): 半导体晶片处理装置
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Application No.: US10180793Application Date: 2002-06-25
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Publication No.: US20020164232A1Publication Date: 2002-11-07
- Inventor: Jeffry A. Davis , Kert L. Dolechek , Gary L. Curtis
- Applicant: Semitool, Inc.
- Applicant Address: null
- Assignee: Semitool, Inc.
- Current Assignee: Semitool, Inc.
- Current Assignee Address: null
- Main IPC: B65G001/10
- IPC: B65G001/10

Abstract:
A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.
Public/Granted literature
- US06599075B2 Semiconductor wafer processing apparatus Public/Granted day:2003-07-29
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