公开(公告)号：US20030205240A1

公开(公告)日：2003-11-06

申请号：US10418695

申请日：2003-04-18

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman

IPC: C23G001/02

CPC classification number: H01L21/02054 ,  B08B3/00 ,  B08B3/02 ,  B08B3/044 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2203/007 ,  B08B2230/01 ,  H01L21/02052 ,  H01L21/3065 ,  H01L21/6704 ,  H01L21/67051 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  Y10S134/902 ,  H01L2924/00

Abstract: In a method for processing a workpiece to remove material from a first surface of the workpiece, steam is introduced onto the first surface under conditions so that at least some of the steam condenses and forms a liquid boundary layer on the first surface. The condensing steam helps to maintain the first surface of the workpiece at an elevated temperature. Ozone is provided around the workpiece under conditions where the ozone diffuses through the boundary layer and reacts with the material on the first surface. The temperature of the first surface is controlled to maintain condensation of the steam.

Abstract translation: 在用于处理工件以从工件的第一表面去除材料的方法中，在条件下将蒸汽引入到第一表面上，使得至少一些蒸汽在第一表面上冷凝并形成液体边界层。 冷凝蒸汽有助于在升高的温度下保持工件的第一表面。 在臭氧通过边界层扩散并与第一表面上的材料反应的条件下，在工件周围设置臭氧。 控制第一表面的温度以保持蒸汽的冷凝。

公开(公告)号：US20030198541A1

公开(公告)日：2003-10-23

申请号：US10457944

申请日：2003-06-09

Applicant: Semitool, Inc.

Inventor： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

IPC: B65G049/07

CPC classification number: H01L21/67754 ,  H01L21/67173 ,  H01L21/6732 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

Abstract: A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.

公开(公告)号：US20030136429A1

公开(公告)日：2003-07-24

申请号：US10055467

申请日：2002-01-22

Applicant: Semitool, Inc.

Inventor： Dana Scranton ,  Eric J. Bergman

IPC: B08B003/10

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B3/102 ,  B08B7/00 ,  B08B2203/005 ,  F26B21/14 ,  H01L21/67028

Abstract: A processor for cleaning, rinsing, and drying workpieces includes a process vessel, an ozone injection system for introducing ozone gas into the process vessel, a liquid injection system for introducing a processing fluid into the process vessel, and a drying system for delivering a drying fluid to the process vessel. The processing fluid is introduced into the process vessel such that the processing fluid lies beneath a workpiece. Ozone gas is introduced into the process vessel. The workpiece is then bathed in the processing fluid. A drying fluid is introduced into the process vessel while the processing fluid is evacuated from the process vessel. Microelectronic workpieces can be cleaned and dried in a single vessel, reducing the equipment and space used in manufacturing.

Abstract translation: 用于清洁，冲洗和干燥工件的处理器包括处理容器，用于将臭氧气体引入处理容器的臭氧注入系统，用于将处理流体引入处理容器的液体注入系统，以及用于输送干燥的干燥系统 流体到处理容器。 将处理流体引入处理容器中，使得处理流体位于工件下方。 将臭氧气体引入加工容器中。 然后将工件浸在处理液中。 将干燥流体引入处理容器中，同时处理流体从处理容器排出。 微电子工件可以在单个容器中进行清洁和干燥，减少制造中使用的设备和空间。

公开(公告)号：US20030102210A1

公开(公告)日：2003-06-05

申请号：US10084962

申请日：2002-02-27

Applicant: Semitool, Inc.

Inventor： Daniel J. Woodruff ,  Kyle M. Hanson

IPC: C25D017/12

CPC classification number: C25D17/12 ,  C25D7/123 ,  C25D17/001

Abstract: An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

公开(公告)号：US20030101616A1

公开(公告)日：2003-06-05

申请号：US10336193

申请日：2003-01-03

Applicant: Semitool, Inc.

Inventor： Dana Scranton ,  Ian Sharp

IPC: F26B003/00

CPC classification number: H01L21/67034 ,  B08B3/06 ,  B08B3/10 ,  B08B3/12 ,  H01L21/67028

Abstract: A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

公开(公告)号：US20030056814A1

公开(公告)日：2003-03-27

申请号：US10200043

申请日：2002-07-19

Applicant: Semitool, Inc.

Inventor： Jon Kuntz ,  Steven Peace ,  Ed Derks ,  Brian Aegerter

IPC: B08B003/00 ,  B08B001/02 ,  B65G049/07 ,  B08B007/00

CPC classification number: H01L21/68785 ,  H01L21/67057 ,  H01L21/67086 ,  H01L21/6715 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/14 ,  Y10S438/906 ,  Y10S438/913

Abstract: A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.

Abstract translation: 用于处理半导体晶片或其它类似的平坦工件的处理系统具有包括工件保持器的头部。 头部的电机旋转工件。 头部升降器降低头部以将工件移动到碗中的液体浴中。 声能被引入到液体中并通过液体传送到工件，以帮助加工。 抬起头部以使工件进入冲洗位置。 浴液被排出。 工件通过基座中的径向喷嘴冲洗。 头部被抬起到干燥的位置。 往复摇摆臂将干燥流体喷射到旋转晶片的底表面上，以干燥晶片。

公开(公告)号：US20030015417A1

公开(公告)日：2003-01-23

申请号：US09683597

申请日：2002-01-23

Applicant: Semitool, Inc.

Inventor： Dakin Fulton ,  Thomas L. Ritzdorf

IPC: B23H007/04 ,  B23H003/02 ,  B23H007/14 ,  C25B009/00 ,  C25B009/04 ,  C25B015/00 ,  C25C003/16 ,  C25C003/20 ,  C25D017/00 ,  C25D021/12 ,  C25F007/00 ,  G01N001/00 ,  G01N021/00 ,  G01N031/00 ,  G01N033/00 ,  G01N015/06 ,  G01N033/48 ,  G04C023/00

CPC classification number: C25D21/14 ,  G05D11/133 ,  Y10T436/11

Abstract: An automated chemical management system for managing the chemical content of an electrochemical bath used to deposit a material on the surface of a microelectronic workpiece is set forth. The automated chemical management system includes a dosing system that is adapted to dose an amount of one or more chemicals to replenish a given electrochemical bath constituent in accordance with a predetermined dosing equation. The chemical management system also includes an analytical measurement system that is adapted to provide a measurement result indicative of the amount of the given constituent in the electrochemical bath at predetermined time intervals. The chemical management system uses the measurement results to modify the dosing equation of the dosing system. In this manner, the replenishment operations executed by the chemical management system are effectively refined over time thereby providing more accurate control of the amount of the target constituent in the electrochemical bath.

公开(公告)号：US20030012623A1

公开(公告)日：2003-01-16

申请号：US10185773

申请日：2002-06-27

Applicant: Semitool, Inc.

Inventor： Jeffry Alan Davis ,  Andro Ardiano Purnomohadi ,  Daniel Thomas Potter

IPC: B65G001/10

CPC classification number: H01L21/67781 ,  G11B17/08 ,  G11B23/00 ,  Y10S414/139 ,  Y10S414/14

Abstract: An apparatus for loading media carriers into a processing chamber, including a pivoting arm mechanism which accepts a carrier in at a lower position, locks it on the arm, and provides a power-assisted movement of the carrier lifting it into an upper position proximate the opening to the processing chamber, where the arm is locked in place, with the carrier then pushed along a ramp on the arm directly into the processing chamber.

Abstract translation: 一种用于将介质载体装载到处理室中的装置，包括在较低位置处接收载体的枢转臂机构将其锁定在臂上，并且提供载体的动力辅助运动，将其提升到靠近 打开到处理室，其中臂被锁定就位，载体然后沿着臂上的坡道被直接推入处理室。

公开(公告)号：US20020157686A1

公开(公告)日：2002-10-31

申请号：US09925884

申请日：2001-08-06

Applicant: Semitool, Inc.

Inventor： Michael Kenny ,  Brian Aegeter ,  Eric Bergman ,  Dana Scranton

IPC: B08B007/04

CPC classification number: H01L21/02052 ,  B08B3/00 ,  B08B3/02 ,  B08B3/044 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2203/007 ,  B08B2203/0288 ,  B08B2230/01 ,  H01L21/02054 ,  H01L21/3065 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/67051 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00

Abstract: In a system for cleaning a workpiece or wafer, a boundary layer of heated liquid is formed on the workpiece surface. Ozone is provided around the workpiece. The ozone diffuses through the boundary layer and chemically reacts with contaminants on the workpiece surface. A jet of high velocity heated liquid is directed against the workpiece, to physically dislodge or remove a contaminant from the workpiece. The jet penetrates through the boundary layer at the point of impact. The boundary layer otherwise remains largely undisturbed. Preferably, the liquid includes water, and may also include a chemical. Steam may also be jetted onto the workpiece, with the steam also physically removing contaminants, and also heating the workpiece to speed up chemical cleaning. The workpiece and the jet of liquid are moved relative to each other, so that substantially all areas of the workpiece surface facing the jet are exposed at least momentarily to the jet. Sonic or electromagnetic energy may also be introduced to the workpiece.

Abstract translation: 在用于清洁工件或晶片的系统中，在工件表面上形成加热液体的边界层。 在工件周围提供臭氧。 臭氧通过边界层扩散并与工件表面上的污染物发生化学反应。 高速加热液体的喷嘴被引导到工件上，以物理地移除或去除工件上的污染物。 喷射器在冲击点穿过边界层。 否则边界层大体上不受干扰。 优选地，液体包括水，并且还可以包括化学品。 蒸汽也可以喷射到工件上，蒸汽还物理地去除污染物，并且还加热工件以加速化学清洁。 工件和液体射流相对于彼此移动，使得面对射流的工件表面的基本上所有区域至少暴露于射流。 也可以将声波或电磁能引入到工件中。

公开(公告)号：US20020139400A1

公开(公告)日：2002-10-03

申请号：US09818042

申请日：2001-03-27

Applicant: Semitool, Inc.

Inventor： Dana Scranton

IPC: B08B003/12

CPC classification number: H01L21/67057 ,  B08B3/102 ,  B08B3/12 ,  H01L21/67051

Abstract: A processor for processing microelectronic workpieces includes a process vessel adapted to hold one or more microelectronic workpieces vertically within a rotatable fixture. A drive motor is coupled to the rotatable fixture to spin the rotatable fixture during processing. A processing fluid is introduced into the process vessel for processing of the microelectronic workpieces. The rotatable fixture is raised out of the processor for loading/unloading. The processor can be used to clean, plate, etch, strip, rinse, or dry microelectronic workpieces.

Abstract translation: 用于处理微电子工件的处理器包括适于将一个或多个微电子工件垂直地保持在可旋转夹具内的处理容器。 驱动马达联接到可转动的固定装置，以在加工过程中旋转可旋转夹具。 将处理流体引入到用于处理微电子工件的处理容器中。 可旋转夹具从处理器中升出以进行装载/卸载。 该处理器可用于清洁，印版，蚀刻，剥离，冲洗或干燥微电子工件。