Invention Application
US20020172022A1 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
有权
用于向具有集成热和EMI管理的微处理器提供电力的方法和装置
- Patent Title: Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
- Patent Title (中): 用于向具有集成热和EMI管理的微处理器提供电力的方法和装置
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Application No.: US10147138Application Date: 2002-05-16
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Publication No.: US20020172022A1Publication Date: 2002-11-21
- Inventor: Joseph Ted DiBene II , David H. Hartke
- Applicant: INCEP Technologies, Inc.
- Applicant Address: null
- Assignee: INCEP Technologies, Inc.
- Current Assignee: INCEP Technologies, Inc.
- Current Assignee Address: null
- Main IPC: H05K001/18
- IPC: H05K001/18
Abstract:
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
Public/Granted literature
- US06947293B2 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management Public/Granted day:2005-09-20
Information query
