公开(公告)号：US20020164895A1

公开(公告)日：2002-11-07

申请号：US10005024

申请日：2001-12-04

Applicant: INCEP Technologies, Inc.

Inventor： David H. Hartke ,  Joseph T. DiBene II

IPC: H05K001/00

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board. A power signal from the power conditioning circuit is provided to the second circuit board at least in part by one of the first set of raised conductive contacts on the flexible circuit and the second set of raised conductive contacts on the second flexible circuit and a ground return is provided to the second circuit board by the other of the first set of raised conductive contacts on the first flexible circuit and the second set of raised conductive contacts on the second flexible circuit.

Abstract translation: 公开了一种用于将具有功率调节电路的第一电路板和具有沿z（垂直）轴设置在其下方的功率耗散部件的第二电路板电互连的方法和装置。 在说明性实施例中，该装置包括具有第一组凸起的导电触点的第一柔性电路，第一柔性电路设置在第二电路板的第一侧上; 以及第二柔性电路，其具有第二组凸起的导电触头，所述第二柔性电路设置在所述第二电路板的与所述第二电路板的第一侧相对的第二侧上。 来自功率调节电路的功率信号至少部分地由柔性电路上的第一组升高的导电触点之一和第二柔性电路上的第二组升高的导电触点和接地回路提供给第二电路板 通过第一柔性电路上的第一组升高的导电触点中的另一个和第二柔性电路上的第二组升高的导电触点而提供给第二电路板。

公开(公告)号：US20020196614A1

公开(公告)日：2002-12-26

申请号：US10201384

申请日：2002-07-23

Applicant: INCEP Technologies, Inc.

Inventor： Joseph T. DiBene II ,  David H. Hartke ,  James J. Hjerpe Kaskade ,  Carl E. Hoge

IPC: H05K001/14 ,  H05K007/20 ,  H01R012/04

CPC classification number: H01L23/433 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

公开(公告)号：US20020176229A1

公开(公告)日：2002-11-28

申请号：US10132586

申请日：2002-04-25

Applicant: INCEP Technologies, Inc.

Inventor： Edward J. Derian ,  Joseph Ted DiBene II ,  David H. Hartke

IPC: H05K007/20 ,  H01L023/48

CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.

Abstract translation: 一种用于从第一电路板向第二电路板提供电力的连接器。 该装置包括第一导电构件，其包括第一导电构件第一端和远离第一端的第一导电构件第二端; 设置在所述第一导电构件内的第二导电构件，所述第二导电构件包括第二导体构件第一端和远离所述第二导体构件第一端的第二导体构件第二端; 以及用于与第一电路板和第二电路板的电耦合的一个或多个第一电路板永久附接特征，以及用于将连接器与第二电路板电耦合的一个或多个可断开的导电特征。

公开(公告)号：US20030057548A1

公开(公告)日：2003-03-27

申请号：US10290722

申请日：2002-11-08

Applicant: INCEP Technologies, Inc.

Inventor： David H. Hartke ,  Joseph Ted Dibene II ,  Edward J. Derian ,  James M. Broder

IPC: H01L023/34

CPC classification number: G06F1/20 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/206 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K7/1092 ,  H01L2924/00

Abstract: The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.

Abstract translation: 本发明被描述为集成电子组件。 电子组件包括散热装置，功率调节电路板，安装在基板上的功率耗散装置和电力互连组件。 功率调节电路板包括热耦合到散热装置的第一侧，用于产生经调节的电力信号的功率调节电路和孔。 功率耗散装置具有通过孔热耦合到散热装置的顶表面。 衬底包括靠近衬底的至少一个边缘布置的至少一个电源导体。 将经调节的功率信号电耦合到基板并且向基板提供基本上所有功率的功率互连组件包括可移除地耦合到基板的至少一个边缘的边缘连接器组件。

公开(公告)号：US20020172022A1

公开(公告)日：2002-11-21

申请号：US10147138

申请日：2002-05-16

Applicant: INCEP Technologies, Inc.

Inventor： Joseph Ted DiBene II ,  David H. Hartke

IPC: H05K001/18

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract translation: 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。

公开(公告)号：US20020151195A1

公开(公告)日：2002-10-17

申请号：US10147395

申请日：2002-05-16

Applicant: INCEP Technologies, Inc.

Inventor： Joseph Ted DiBene II ,  David H. Hartke

IPC: H05K001/00

CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K7/20509 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method and apparatus for providing power from a first circuit board to a second circuit board is disclosed. The apparatus comprises a flex circuit having a plurality of conductive paths formed by a plurality of first conductive areas electrically coupled to a plurality of second conductive areas wherein the plurality of first conductive areas permanently and electrically coupled to a plurality of first circuit board conductive pads and the plurality of second conductive areas disconnectably and electrically coupleable to at least one second circuit board conductive pad.

Abstract translation: 公开了一种从第一电路板向第二电路板提供电力的方法和设备。 该装置包括柔性电路，该柔性电路具有由多个第一导电区域形成的多个导电路径，该多个第一导电区域电耦合到多个第二导电区域，其中多个第一导电区域永久并电耦合到多个第一电路板导电焊盘， 所述多个第二导电区域可拆卸地并且电连接到至少一个第二电路板导电焊盘。