发明申请
- 专利标题： Semiconductor wirebond machine leadframe thermal map system
- 专利标题（中）： 半导体引线框引线框热图系统
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申请号： US10198817申请日： 2002-07-18
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公开(公告)号： US20020181538A1公开(公告)日： 2002-12-05
- 发明人: Craig T. Clyne
- 主分类号： G01K001/00
- IPC分类号： G01K001/00 ; G01K013/12
摘要：
A method and apparatus for measuring the surface temperatures of wire-bonded semiconductors and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
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