Semiconductor wirebond machine leadframe thermal map system
    1.
    发明申请
    Semiconductor wirebond machine leadframe thermal map system 失效
    半导体引线框引线框热图系统

    公开(公告)号:US20020181538A1

    公开(公告)日:2002-12-05

    申请号:US10198817

    申请日:2002-07-18

    发明人: Craig T. Clyne

    IPC分类号: G01K001/00 G01K013/12

    摘要: A method and apparatus for measuring the surface temperatures of wire-bonded semiconductors and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.

    摘要翻译: 用于测量用于制备热图的引线键合半导体等的表面温度的方法和装置包括适于将荧光衰减温度传感器安装在毛细管支架中的常规超声波引线接合机。 提供触发箱电路以基于来自超声波接合控制器的电压信号的启动来触发温度测量。 提供了一个计算机,用于协调舞台控制和温度测量,以及将温度,时间和位置指示整理和绘制为热图和其他显示/打印的相关性。

    Methods and apparatus for indicating temperature-related events
    2.
    发明申请
    Methods and apparatus for indicating temperature-related events 审中-公开
    用于指示温度相关事件的方法和装置

    公开(公告)号:US20040247014A1

    公开(公告)日:2004-12-09

    申请号:US10812862

    申请日:2004-03-30

    IPC分类号: G01K013/12

    摘要: The present invention relates to reliable and accurate techniques and devices for detecting and indicating temperature-related conditions and events associated with various items such as foods and medicines.

    摘要翻译: 本发明涉及用于检测和指示与诸如食品和药物等各种物品相关联的温度相关条件和事件的可靠和精确的技术和装置。

    Temperature sensor with improved response time
    3.
    发明申请
    Temperature sensor with improved response time 审中-公开
    温度传感器具有更好的响应时间

    公开(公告)号:US20040101031A1

    公开(公告)日:2004-05-27

    申请号:US10065836

    申请日:2002-11-25

    CPC分类号: G01K1/16

    摘要: A temperature sensor comprises a temperature sensing element (10) having a coating (30) thereon with a high thermal diffusivity thereon to improve response time of the sensor to changes in temperature. The coating can include a plastic resin matrix containing thermally conductive particles.

    摘要翻译: 温度传感器包括其上具有高热扩散性的涂层(30)的温度感测元件(10),以改善传感器对温度变化的响应时间。 涂层可以包括含有导热颗粒的塑料树脂基质。