Invention Application
US20020181826A1 Structure and method for fabricating a high-speed interface in semiconductor structures 审中-公开
用于在半导体结构中制造高速界面的结构和方法

Structure and method for fabricating a high-speed interface in semiconductor structures
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates by forming a compliant substrate for growing the monocrystalline layers. One way to achieve compliancy includes first growing on a silicon wafer an accommodating buffer layer that is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. In this way, high speed devices can be fabricated along with integral silicon-based circuitry to provide an efficient, low-cost semiconductor structure. Moreover, I/O pins and their associated problems can be eliminated.
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