发明申请
US20020185222A1 High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
有权
高Tg丙烯酸聚合物和含环氧基的共混物作为压敏粘合剂
- 专利标题： High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
- 专利标题（中）： 高Tg丙烯酸聚合物和含环氧基的共混物作为压敏粘合剂
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申请号： US09876094申请日： 2001-06-08
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公开(公告)号： US20020185222A1公开(公告)日： 2002-12-12
- 发明人: Robert M. Wigdorski , Michael J. Zajaczkowski , Kevin J. McKinney
- 申请人： Adhesives Research, Inc.
- 申请人地址： US PA Glen Rock
- 专利权人： Adhesives Research, Inc.
- 当前专利权人： Adhesives Research, Inc.
- 当前专利权人地址： US PA Glen Rock
- 主分类号： B32B031/26
- IPC分类号： B32B031/26
摘要：
A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer having a Tg>20null C., a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the polymer having a Tg>50null C. When blended with an epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be thermocured.
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