Continuous void-free uniform coatings are formed on substrates of limited length. The substrate is wrapped around a mounting roll and nipped between the mounting roll and one or more pick-and-place contacting rolls. Coating liquid is applied to the substrate or to a pick-and-place roll, preferably as a pattern of stripes. The mounting roll, substrate and pick-and-place rolls are caused to rotate for a plurality of revolutions. Wetted surface portions of the pick-and-place roll repeatedly contact the substrate, the coating is repeatedly picked up from and placed onto the substrate, and the coating becomes more uniform. Extremely uniform and extremely thin coatings can be quickly and easily obtained, with easy adjustment of the final coating thickness.