Invention Application
- Patent Title: Method for forming an interface free layer of silicon on a substrate of monocrystalline silicon
- Patent Title (中): 在单晶硅衬底上形成硅界面自由层的方法
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Application No.: US10242293Application Date: 2002-09-12
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Publication No.: US20030060028A1Publication Date: 2003-03-27
- Inventor: Peter Ward , Simona Lorenti , Giuseppe Ferla
- Applicant: STMICROELECTRONICS S.r.l.
- Applicant Address: IT AGRATE BRIANZA
- Assignee: STMICROELECTRONICS S.r.l.
- Current Assignee: STMICROELECTRONICS S.r.l.
- Current Assignee Address: IT AGRATE BRIANZA
- Priority: EP01830580.5 20010913
- Main IPC: H01L021/331
- IPC: H01L021/331 ; H01L021/20 ; C30B001/00 ; H01L021/36

Abstract:
A method for forming an interface free layer of silicon on a substrate of monocrystalline silicon is provided. According to the method, a substrate of monocrystalline silicon having a surface substantially free of oxide is provided. A silicon layer in-situ doped is deposited on the surface of the substrate in an oxygen-free environment and at a temperature below 700null C. so as to produce a monocrystalline portion of the silicon layer adjacent to the substrate and a polycrystalline portion of the silicon layer spaced apart from the substrate. The silicon layer is heated so as to grow the monocrystalline portion of the silicon layer through a part of the polycrystalline portion of the silicon layer. Also provided is a method for manufacturing a bipolar transistor.
Public/Granted literature
- US06806170B2 Method for forming an interface free layer of silicon on a substrate of monocrystalline silicon Public/Granted day:2004-10-19
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