Invention Application
- Patent Title: High density ethylene homopolymers and blend compositions
- Patent Title (中): 高密度乙烯均聚物和共混组合物
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Application No.: US10173256Application Date: 2002-06-13
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Publication No.: US20030088021A1Publication Date: 2003-05-08
- Inventor: Jozef J. Van Dun , Akira Miyamoto , Grant B. Jacobsen , Fumio Matsushita , Schouterden J. Patrick , Spencer Lee , Pak-Wing S. Chum , Larry A. Meiske , Wauteraerts L. Peter
- Applicant: The Dow Chemical Company
- Applicant Address: null
- Assignee: The Dow Chemical Company
- Current Assignee: The Dow Chemical Company
- Current Assignee Address: null
- Main IPC: C08G063/48
- IPC: C08G063/48

Abstract:
Blend compositions containing a novel homopolymer, the use of which allows the incorporation of more comonomer in the additional components of the blend (for the same overall density) resulting in increased tie molecule formation and improvement in properties such as ESCR, toughness and impact strength are disclosed. The homopolymers are important for applications where a high density is needed to ensure certain mechanical properties like abrasion resistance, indentation resistance, pressure resistance, topload resistance, modulus of elasticity, or morphology (for the chlorination of PE to CPE) and additional advantages such as melt processability. The blend can be obtained by dry or melt mixing the already produced components, or through in-situ production by in parallel and/or in series arranged reactors. These resins can be used in applications such as films, blow molded, injection molded, and rotomolded articles, fibres, and cable and wire coatings and jacketings and, various forms of pipe.
Public/Granted literature
- US07153909B2 High density ethylene homopolymers and blend compositions Public/Granted day:2006-12-26
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