A nail polish removal system having multiple pads that are impregnated with a nail polish removing solvent and held within a container. The pads of the nail polish removal system are optimally dimensioned to retain an effective amount of solvent so that one individual pad can remove the nail polish from up to 10 fingers or 10 toes without the creation of droplets or spillage of excess solvent. Further, the material of the pads is soft and pliable, which contributes to the ease and comfort of their use.