Invention Application
- Patent Title: Microdischarge devices and arrays having tapered microcavities
- Patent Title (中): 具有锥形微腔的微放电器件和阵列
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Application No.: US10047469Application Date: 2002-01-15
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Publication No.: US20030132693A1Publication Date: 2003-07-17
- Inventor: J. Gary Eden , Sung-Jin Park , Jack Chen , Chang Liu
- Main IPC: H01J017/04
- IPC: H01J017/04
Abstract:
A microdischarge device has a semiconductor layer, an intermediate layer, and a conductive layer. A tapered cavity is disposed in at least the semiconductor layer.
Public/Granted literature
- US07112918B2 Microdischarge devices and arrays having tapered microcavities Public/Granted day:2006-09-26
Information query
