Invention Application
- Patent Title: Molding composition based on polyetheramides
- Patent Title (中): 基于聚醚酰胺的成型组合物
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Application No.: US10347439Application Date: 2003-01-21
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Publication No.: US20030162899A1Publication Date: 2003-08-28
- Inventor: Franz-Erich Baumann , Martin Himmelmann , Wilfried Bartz , Olivier Farges
- Applicant: Degussa AG
- Applicant Address: DE Duesseldorf
- Assignee: Degussa AG
- Current Assignee: Degussa AG
- Current Assignee Address: DE Duesseldorf
- Priority: DE10201903.7 20020119
- Main IPC: C08F008/30
- IPC: C08F008/30

Abstract:
A molding composition containing the following components: I. from 99.9 to 95 parts by weight of a polyetheramide obtained from 1) a linear aliphatic diamine having from 6 to 12 carbon atoms, 2) a linear aliphatic or aromatic dicarboxylic acid having from 6 to 12 carbon atoms, and 3) a polyetherdiamine having at least 3 carbon atoms per ethereal oxygen atom and having a primary amino group at an end of the chain, and II. from 0.1 to 5 parts by weight of a copolymer which contains from 0.8 to 20% by weight of an anhydride or an epoxide in copolymerized form, wherein the total amount of I. and II. is 100 parts by weight, is suitable for the extrusion of flexible pipes, and also for the production of flexible blow-molded articles.
Public/Granted literature
- US06884485B2 Molding composition based on polyetheramides Public/Granted day:2005-04-26
Information query