A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer having a Tg>20null C., a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the polymer having a Tg>50null C. When blended with an epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be thermocured.