Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus

Invention Application

US20030171070A1 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus 有权

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Patent Title: Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
Application No.: US10391095

Application Date: 2003-03-18
Publication No.: US20030171070A1

Publication Date: 2003-09-11
Inventor: Robert D. Tolles
Applicant: Applied Materials, a Delaware corporation
Applicant Address: null
Assignee: Applied Materials, a Delaware corporation
Current Assignee: Applied Materials, a Delaware corporation
Current Assignee Address: null
Main IPC: B24B049/00
IPC: B24B049/00 ; B24B051/00

Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus

Abstract:

The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is prevented from penetrating the impermeable transparent sheet to the bottom layer of the polishing pad.

Public/Granted literature

US07189141B2 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus Public/Granted day:2007-03-13

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