公开(公告)号：US20030171070A1

公开(公告)日：2003-09-11

申请号：US10391095

申请日：2003-03-18

Applicant: Applied Materials, a Delaware corporation

Inventor： Robert D. Tolles

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/205 ,  B24B37/013 ,  B24B49/12 ,  Y10S451/921

Abstract: The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is prevented from penetrating the impermeable transparent sheet to the bottom layer of the polishing pad.

公开(公告)号：US20020013120A1

公开(公告)日：2002-01-31

申请号：US09929903

申请日：2001-08-14

Applicant: Applied Materials, a Delaware corporation

Inventor： Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Buguslaw Swedek ,  Manoocher Birang

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  G01B11/0683 ,  H01L21/3212

Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.

Abstract translation: 一种装置以及方法使基板的表面与具有窗口的抛光垫接触，引起基板和抛光垫之间的相对运动，并引导光束通过窗口，使得运动 抛光垫相对于基底使得光束在穿过基底的路径中移动。 检测来自基板的光束反射，并用于确定抛光参数，检测过程重复性和限定工艺。

公开(公告)号：US20040209559A1

公开(公告)日：2004-10-21

申请号：US10838689

申请日：2004-05-03

Applicant: Applied Materials, a Delaware corporation

Inventor： Manoocher Birang ,  Lawrence M. Rosenberg ,  Sandra L. Rosenberg ,  Sasson Somekh ,  John M. White

IPC: B24B001/00

CPC classification number: B24B21/004 ,  B24B21/008 ,  B24B21/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/16 ,  B24B37/24 ,  B24B37/245 ,  B24B53/017 ,  B24D7/12 ,  H01L21/30625

Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.

Abstract translation: 化学机械抛光装置具有可转动的压板，比在两个卷轴之间延伸的基板宽的抛光片，用于推进抛光片的驱动机构和用于间歇地将抛光片固定到压板上的夹持机构。 压板可以具有适于接收圆形压板顶部或矩形压板顶部的压板基座。