Invention Application
- Patent Title: Plate-type heat pipe and method for manufacturing the same
- Patent Title (中): 板式热管及其制造方法
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Application No.: US10109598Application Date: 2002-03-26
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Publication No.: US20030173064A1Publication Date: 2003-09-18
- Inventor: Tatsuhiko Ueki , Masaaki Yamamoto , Yuichi Kimura
- Priority: JP2001-110300 20010409; JP2001-305064 20011001; JP2001-393816 20011226
- Main IPC: F28D015/00
- IPC: F28D015/00 ; B23P006/00

Abstract:
A plate-type heat pipe including a hermetically sealed container in which a working fluid is received, said container comprising a plate member on which at least one heat generating device is thermally connected and another plate member forming a cavity inside thereof in combination with said plate member, and said container being formed by pressure-bonding both peripheral portions of said plate member and said another plate member combined together.
Public/Granted literature
- US06871701B2 Plate-type heat pipe and method for manufacturing the same Public/Granted day:2005-03-29
Information query