Invention Application
US20030173064A1 Plate-type heat pipe and method for manufacturing the same 有权
板式热管及其制造方法

  • Patent Title: Plate-type heat pipe and method for manufacturing the same
  • Patent Title (中): 板式热管及其制造方法
  • Application No.: US10109598
    Application Date: 2002-03-26
  • Publication No.: US20030173064A1
    Publication Date: 2003-09-18
  • Inventor: Tatsuhiko UekiMasaaki YamamotoYuichi Kimura
  • Priority: JP2001-110300 20010409; JP2001-305064 20011001; JP2001-393816 20011226
  • Main IPC: F28D015/00
  • IPC: F28D015/00 B23P006/00
Plate-type heat pipe and method for manufacturing the same
Abstract:
A plate-type heat pipe including a hermetically sealed container in which a working fluid is received, said container comprising a plate member on which at least one heat generating device is thermally connected and another plate member forming a cavity inside thereof in combination with said plate member, and said container being formed by pressure-bonding both peripheral portions of said plate member and said another plate member combined together.
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