Invention Application
- Patent Title: TECHNIQUES FOR PLASMA ETCHING SILICON-GERMANIUM
- Patent Title (中): 等离子体蚀刻硅锗的技术
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Application No.: US10093050Application Date: 2002-03-06
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Publication No.: US20030176075A1Publication Date: 2003-09-18
- Inventor: Anisul Khan , Ajay Kumar , Padmapani Nallan
- Applicant: Applied Materials, Inc.
- Applicant Address: null
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: null
- Main IPC: H01L021/4763
- IPC: H01L021/4763

Abstract:
The present invention provides novel etching techniques for etching SinullGe, employing SF6/fluorocarbon etch chemistries at a low bias power. These plasma conditions are highly selective to organic photoresist. The techniques of the present invention are suitable for fabricating optically smooth SinullGe surfaces. A cavity was etched in a layer of a first SinullGe composition using SF6/C4F8 etch chemistry at low bias power. The cavity was then filled with a second SinullGe composition having a higher refractive index than the first SinullGe composition. A waveguide was subsequently fabricated by depositing a cladding layer on the second SinullGe composition that was formed in the cavity. In a further embodiment a cluster tool is employed for executing processing steps of the present invention inside the vacuum environment of the cluster tool. In an additional embodiment a manufacturing system is provided for fabricating waveguides of the present invention. The manufacturing system includes a controller that is adapted for interacting with a plurality of fabricating stations.
Public/Granted literature
- US06642151B2 Techniques for plasma etching silicon-germanium Public/Granted day:2003-11-04
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