Invention Application
- Patent Title: Chemical mechanical polishing with multiple polishing pads
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Application No.: US10425684Application Date: 2003-04-28
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Publication No.: US20030190865A1Publication Date: 2003-10-09
- Inventor: Sasson Somekh
- Applicant: Applied Materials, Inc., a Delaware corporation
- Applicant Address: null
- Assignee: Applied Materials, Inc., a Delaware corporation
- Current Assignee: Applied Materials, Inc., a Delaware corporation
- Current Assignee Address: null
- Main IPC: B24B049/00
- IPC: B24B049/00 ; B24B051/00 ; B24B001/00 ; B24B007/19 ; B24B007/30
Abstract:
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.
Public/Granted literature
- US06848976B2 Chemical mechanical polishing with multiple polishing pads Public/Granted day:2005-02-01
Information query
