公开(公告)号：US20040242127A1

公开(公告)日：2004-12-02

申请号：US10865822

申请日：2004-06-14

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Akihiro Tanoue ,  Yoshiharu Hidaka ,  Shin Hashimoto

IPC: B24B001/00 ,  B24B007/19

CPC classification number: B24B37/04 ,  B24B57/02

Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.

公开(公告)号：US20040180612A1

公开(公告)日：2004-09-16

申请号：US10801316

申请日：2004-03-16

Applicant: Cabot Microelectronics Corporation

Inventor： Renjie Zhou ,  Steve K. Grumbine ,  Isaac K. Cherian

IPC: B24B001/00 ,  B24B007/19

CPC classification number: B24B37/24 ,  B24B37/245 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/3212 ,  Y10T156/1051

Abstract: The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or a water-soluble boron-containing compound, or salt thereof, that is not boric acid, and a method of polishing a substrate using the chemical-mechanical polishing system.

Abstract translation: 本发明提供了一种化学机械抛光系统，其包括研磨剂，载体和硼酸或其共轭碱，其中硼酸和共轭碱在抛光体系中不以一定的量存在于抛光体系中 pH缓冲液或不是硼酸的水溶性含硼化合物或其盐，以及使用化学机械抛光系统抛光基材的方法。

公开(公告)号：US20040164058A1

公开(公告)日：2004-08-26

申请号：US10784084

申请日：2004-02-20

Applicant: Hypertherm, Inc.

Inventor： Nicholas A. Sanders ,  Richard W. Couch ,  Yong Yang ,  Zhipeng Lu ,  Robert C. Dean ,  Kenneth J. Woods ,  Charles M. Hackett ,  John Sobr ,  William J. Connally

IPC: B24B007/19

CPC classification number: B26F3/004 ,  B23K28/00 ,  B26F3/06

Abstract: A metal jet cutting system, which includes a jetting heat, a heater and a power source, is used for modifying a workpiece. The jetting head includes a crucible and an inlet for receiving a feed stock of a conductive material. The heater melts the conductive material in the crucible to provide a conductive fluid, which exits the jetting head via an outlet. The power source, which is in electrical communication with the conductive fluid, increases the temperature of the conductive fluid. The conductive fluid is applied to the workpiece to modify the workpiece.

公开(公告)号：US20040132384A1

公开(公告)日：2004-07-08

申请号：US10336718

申请日：2003-01-06

Inventor： Chih-Jung Chen

IPC: B24B001/00 ,  B24B007/19 ,  B24B007/30

CPC classification number: B24B37/042 ,  B08B3/08 ,  B08B7/0035 ,  H01L21/02063 ,  H01L21/02074

Abstract: A method for cleaning residue of alignment marks on a CMP polished wafer. The method includes application of a strong acid or oxygen plasma to the wafer to remove the residue.

Abstract translation: 一种用于清除CMP抛光晶片上的对准标记残留物的方法。 该方法包括向晶片施加强酸或氧等离子体以除去残余物。

公开(公告)号：US20040116053A1

公开(公告)日：2004-06-17

申请号：US10605158

申请日：2003-09-11

Applicant: DISC DEALER INC.

Inventor： Carlo Smith ,  Les Kollegian

IPC: B24B007/19

CPC classification number: B24B5/36 ,  B24B7/30

Abstract: Embodiments of the invention abrade the information bearing surface of a compact disc (CD), DVD or other digital information bearing disk, in order to render it unreadable by standard consumer grade disk readers. This is accomplished via embodiments of the invention that are extremely lightweight, highly portable and inexpensive. Embodiments may or may not employ an outer case in order to retain the remnants of the abraded information layer of the disk. In order to operate one embodiment of the invention, the apparatus is opened and a compact disc is inserted with the face of the disk against the abrasive mechanism. After closing the apparatus, the outer housing of the apparatus is rotated with sufficient pressure against the abrasive mechanism in order to cause the substrate to be damaged sufficiently to render it unreadable by consumer based disk readers. The apparatus can be opened over a trash bin in order to empty both the disk and the particulate matter generated by the abrasive process. The apparatus may be rotated by hand or by motor in various embodiments. A case-less embodiment of the invention exists that comprises the abrasive mechanism and a post that fits into the center hole of the disk. Since there is no outer case coupled to the apparatus in this embodiment, the embodiment may be held over a trash bin while abrading the disk in order to dispose of the particulate matter resulting from the abrading process. In order to operate this embodiment, a disk is inserted into the opening between the abrader and post supporter and the post engages the hole in the center of the disk. The disk is then rotated in order to abrade the information bearing portion of the disk. When the disk has been abraded to the satisfaction of the user, the disk is disengaged from the post and the disk is removed and disposed of.

Abstract translation: 本发明的实施例磨擦光盘（CD），DVD或其他数字信息承载盘的信息承载表面，以便使其不被标准消费级盘读取器读取。 这通过本发明的实施例来实现，其是非常轻便的，高度便携的和便宜的。 实施例可以采用或可以不采用外壳，以便保留盘磨损的信息层的残余物。 为了操作本发明的一个实施例，打开设备，并且将光盘与盘的表面相对于研磨机构插入。 在关闭设备之后，设备的外部壳体以足够的压力旋转抵靠研磨机构，以便使基板被充分损坏，从而使其不能被基于消费者的盘读取器读取。 该设备可以在垃圾桶上打开，以便清空盘和磨料过程产生的颗粒物质。 在各种实施例中，该装置可以由手动或马达旋转。 存在本发明的无壳体实施例，其包括研磨机构和装配到盘的中心孔中的柱。 由于在本实施例中没有联接到装置的外壳，所以可以将实施例保持在垃圾箱上，同时研磨盘以便处理由研磨过程产生的颗粒物质。 为了操作该实施例，盘被插入到研磨器和支柱支架之间的开口中，并且柱接合盘的中心的孔。 然后旋转盘以磨擦盘的信息承载部分。 当磁盘磨损到使用者满意时，磁盘与柱脱离，并且磁盘被移除并被处理。

公开(公告)号：US20040063387A1

公开(公告)日：2004-04-01

申请号：US10262285

申请日：2002-09-30

Inventor： Chris E. Barns

IPC: B24B007/19

CPC classification number: B24B37/26 ,  B24B57/02 ,  Y10S451/921

Abstract: The present invention describes an apparatus that includes a polish pad, the polish pad including a first through-opening; a vertical distribution layer located below the polish pad, the vertical distribution layer connected to the through-opening; a lateral distribution layer located below the vertical distribution layer, the lateral distribution layer connected to the vertical distribution layer; and a slurry dispense located over a front-side of the polish pad, the slurry dispense to provide a slurry to be transported through the polish pad to the lateral distribution layer. The present invention further describes a method including dispensing a slurry at a front-side of a polish pad; flowing the slurry to a location below the polish pad; flowing the slurry upwards and outwards, towards edges of the polish pad; and distributing the slurry to an upper surface of the polish pad.

Abstract translation: 本发明描述了一种包括抛光垫的装置，抛光垫包括第一通孔; 位于抛光垫下方的垂直分布层，垂直分布层连接到通孔; 位于所述垂直分布层下方的横向分布层，所述横向分布层连接到所述垂直分布层; 以及浆料分配位于抛光垫的前侧上，浆料分配以提供待通过抛光垫传送到侧向分布层的浆料。 本发明还描述了一种方法，包括在抛光垫的前侧分配浆料; 将浆料流到抛光垫下方的位置; 将浆料向上和向外流向抛光垫的边缘; 并将浆料分配到抛光垫的上表面。

公开(公告)号：US20040043707A1

公开(公告)日：2004-03-04

申请号：US10344660

申请日：2003-02-14

Inventor： Kazuhito Takanashi ,  Kiyoshi Suzuki ,  Yoshinori Watanabe

IPC: B24B001/00 ,  B24B007/19 ,  B24B007/30

CPC classification number: H01L21/02024 ,  B24B37/22 ,  B24B37/24

Abstract: There is provided a method for polishing a semiconductor wafer, in which by using a specific polishing cloth as one for use in a mirror polishing step for the semiconductor wafer, especially in a final polishing stage thereof, generation of micro-scratches and blind scratches on a wafer surface is prevented. In a polishing step of mirror polishing the semiconductor wafer using a polishing cloth, the polishing is performed using the polishing cloth with a nap layer of 500 nullm or more in thickness.

Abstract translation: 提供了一种用于抛光半导体晶片的方法，其中通过使用用于半导体晶片的镜面抛光步骤中的特定抛光布，特别是在其最终抛光阶段，产生微划痕和盲目划痕 防止晶片表面。 在使用研磨布对半导体晶片进行镜面抛光的抛光工序中，使用500μm以上的薄层的研磨布进行研磨。

公开(公告)号：US20030236057A1

公开(公告)日：2003-12-25

申请号：US10464458

申请日：2003-06-19

Applicant: Tokyo Seimitsu Co. Ltd.

Inventor： Takashi Fujita

IPC: B24B001/00 ,  B24B007/19 ,  B24B055/04

CPC classification number: B24B37/345 ,  B24B37/04 ,  B24B37/042

Abstract: In a wafer polishing apparatus which polishes a wafer surface or in a wafer cleaner, there are provided a transfer and cleaning chamber which shuts off a wafer from the outside air and an inert gas supply device which fills an inert gas into the transfer and cleaning chamber. Thus, there are provided a polishing apparatus, a cleaner, a cleaning method and a wafer evacuation program which can prevent the oxidation and modification of a wafer surface in each step, such as the polishing step of a wafer, the transfer step after polishing, the cleaning step after polishing, the drying step after polishing, the inspection step after polishing, and the storage step after polishing.

Abstract translation: 在对晶片表面进行抛光或晶片清洗器的晶片抛光装置中，设置有将外部空气切断晶片的转移和清洁室以及将惰性气体填充到转移和清洁室中的惰性气体供给装置 。 因此，提供了可以防止晶片的抛光步骤，抛光后的转印步骤等各步骤中的晶片表面的氧化和改性的抛光装置，清洁剂，清洁方法和晶片排出程序， 抛光后的清洗步骤，抛光后的干燥步骤，抛光后的检查步骤以及抛光后的储存步骤。

公开(公告)号：US20030211816A1

公开(公告)日：2003-11-13

申请号：US10143197

申请日：2002-05-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Chih Liu ,  Jackson Hsu ,  Island Ho ,  Ben Liu

IPC: B24B001/00 ,  B24B007/19 ,  B24B007/30

CPC classification number: B24B53/017 ,  B24B53/013

Abstract: A high-pressure pad cleaning system that can be used in conjunction with semiconductor device fabrication tools that utilize pads, such as chemical-mechanical polishing (CMP) tools, is disclosed. A system includes a turntable, first and second outlets, and a dresser. A pad is placed on the turntable, where the turntable rotates in a first direction. The first outlet supplies a dressing solution, such as deionized water, onto the pad at a first pressure, substantially at a single point on the center of the pad. The second outlet supplies the solution onto the pad at a second pressure greater than the first pressure, substantially at a radial line from the center of the pad to its edge at an angle and in a direction opposite to the first direction.

Abstract translation: 公开了一种可以与使用诸如化学机械抛光（CMP）工具的焊盘的半导体器件制造工具结合使用的高压焊盘清洁系统。 系统包括转盘，第一和第二出口以及修整器。 转盘上放置有一个垫，转台在第一个方向旋转。 第一个出口在第一压力下，基本上在垫的中心上的单个点处，将诸如去离子水的敷料溶液提供到垫上。 所述第二出口以大于所述第一压力的第二压力将所述溶液提供到所述垫上，所述第二压力基本上在从所述垫的中心到其边缘的一个径向线上以一角度和与所述第一方向相反的方向。

公开(公告)号：US20030205221A1

公开(公告)日：2003-11-06

申请号：US10138003

申请日：2002-05-03

Inventor： Charles Leu

IPC: B28D001/04 ,  B24B007/19

CPC classification number: G02B5/285 ,  B28D5/022 ,  H01L21/67092 ,  H01L21/78

Abstract: A method for cutting thin film filter work pieces has two embodiments. In a first embodiment, an intermediate layer (13) binds an augmenting substrate (14) to a glass substrate (12) of the work piece (16) prior to cutting of the work piece. In a second embodiment, the work piece (23) comprises a glass substrate (22) which is thicker than a final desired thickness. After the work piece is cut, a surplus portion (222) of the glass substrate is removed. Both embodiments of the method increase the effective thickness of the work piece, which reduces the residual stress in the final thin film filter product, and reduces the risk of a film stack (11, 21) of the work piece peeling from the glass substrate during the cutting process.

Abstract translation: 切割薄膜过滤器工件的方法具有两个实施例。 在第一实施例中，在切割工件之前，中间层（13）将增强基板（14）与工件（16）的玻璃基板（12）结合。 在第二实施例中，工件（23）包括比最终期望厚度厚的玻璃基板（22）。 在切割工件之后，去除玻璃基板的剩余部分（222）。 该方法的两个实施例增加了工件的有效厚度，这降低了最终薄膜过滤器产品中的残余应力，并降低了工件从玻璃基板上剥离的薄膜堆叠（11,21）的风险 切割过程。