发明申请
- 专利标题： Apparatus and method for electropolishing a substrate in an electroplating cell
- 专利标题（中）： 在电镀槽中电抛光衬底的装置和方法
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申请号： US10133786申请日： 2002-04-24
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公开(公告)号： US20030201170A1公开(公告)日： 2003-10-30
- 发明人: Srinivas Gandikota , Muhammad Atif Malik , Michael Wood
- 申请人： Applied Materials, Inc.
- 申请人地址： null
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： null
- 主分类号： C25C007/04
- IPC分类号： C25C007/04
摘要：
An electrolyte cell receives a substrate for processing, a first electrode disposed in the electrolyte cell, the first electrode comprising at least a contact ring, a second electrode disposed within the electrolyte cell and spaced from the first electrode, and a porous membrane that is connected to the electrolyte cell and extends across at least a portion of the electrolyte cell, the membrane is positioned between a location for positioning a substrate when processing and surrounding electrolyte.
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