公开(公告)号：US20040173454A1

公开(公告)日：2004-09-09

申请号：US09981191

申请日：2001-10-16

Applicant: Applied Materials, Inc.

Inventor： Donald J.K. Olgado ,  Michael Wood ,  Dmitry Lubomirsky

IPC: C25D007/12 ,  C25D005/02

CPC classification number: C25D7/123 ,  C25D5/028 ,  C25D17/001 ,  C25D17/06 ,  H01L21/2885

Abstract: An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly having a substrate engaging surface formed thereon, the substrate engaging surface being configured to engage a substrate on the non-production surface. The apparatus further includes an electrical contact device positioned on the substrate engaging surface, the electrical contact device including a plurality of radially spaced electrically conductive members configured to electrically communicate with the non-production surface of the substrate positioned on the substrate engaging surface. The method includes depositing a conductive seed layer on a production surface of the substrate, and depositing a backside conductive layer on a portion of the non-production side of the substrate, the backside conductive layer extending around a bevel of the substrate to electrically communicate with the seed layer. The method further includes securing the substrate in a chuck configured to engage the non-production surface of the substrate, contacting the backside conductive layer with an electrical cathode contact on the non-production side of the substrate, and plating over the conductive seed layer via application of an electrolyte to the production surface of the substrate and applying an electrical bias to the electrical cathode contact and an anode in communication with the electrolyte.

Abstract translation: 一种用于固定和电接触衬底的非生产表面上的衬底的装置和方法。 该设备包括具有形成在其上的衬底接合表面的衬底保持器组件，衬底接合表面被配置为接合非生产表面上的衬底。 所述装置还包括位于所述基板接合表面上的电接触装置，所述电接触装置包括多个径向隔开的导电构件，所述导电构件构造成与位于所述基板接合表面上的所述基板的非生产表面电连通。 该方法包括在衬底的生产表面上沉积导电种子层，以及在衬底的非生产侧的一部分上沉积背面导电层，所述背面导电层围绕衬底的斜面延伸以与 种子层。 该方法还包括将衬底固定在配置成接合衬底的非生产表面的卡盘中，使背面导电层与衬底的非生产侧上的电阴极接触接触，并且在导电种子层上电镀 将电解质施加到基材的生产表面上，并将电偏压施加到电阴极接触件和与电解质连通的阳极。

公开(公告)号：US20030201170A1

公开(公告)日：2003-10-30

申请号：US10133786

申请日：2002-04-24

Applicant: Applied Materials, Inc.

Inventor： Srinivas Gandikota ,  Muhammad Atif Malik ,  Michael Wood

IPC: C25C007/04

CPC classification number: C25D7/12 ,  C25D17/005 ,  C25D17/008 ,  C25F7/00

Abstract: An electrolyte cell receives a substrate for processing, a first electrode disposed in the electrolyte cell, the first electrode comprising at least a contact ring, a second electrode disposed within the electrolyte cell and spaced from the first electrode, and a porous membrane that is connected to the electrolyte cell and extends across at least a portion of the electrolyte cell, the membrane is positioned between a location for positioning a substrate when processing and surrounding electrolyte.

Abstract translation: 电解质电池接收用于处理的衬底，设置在电解质电池中的第一电极，第一电极至少包括接触环，设置在电解质电池内并与第一电极间隔开的第二电极和连接的电极 并且延伸穿过电解质电池的至少一部分，当处理和围绕电解质时，膜位于用于定位衬底的位置之间。