This invention provides a computer apparatus which is connected to an exposure apparatus capable of executing AGA measurement by using a set parameter value and another parameter value and executing acquisition processing of acquiring measurement results, and an overlay inspection apparatus for inspecting the processing result obtained with the set parameter value in the exposure apparatus, and which executes optimization processing of optimizing the set parameter value on the basis of the processing results acquired in acquisition processing and the inspection result value by the inspection apparatus. The computer apparatus causes the inspection apparatus to acquire and accumulate inspection result values, and evaluates variations in processing results on the basis of the accumulated inspection results. Based on the evaluation result, the computer apparatus decides a frequency at which acquisition processing in the semiconductor exposure apparatus is executed. While a decrease in volume production throughput is prevented during volume production by the industrial device, the parameter value can be optimized during volume production.