发明申请
US20040020046A1 Production method for conductive paste and production method for printed circuit
审中-公开
导电胶的生产方法和印刷电路的制造方法
- 专利标题: Production method for conductive paste and production method for printed circuit
- 专利标题(中): 导电胶的生产方法和印刷电路的制造方法
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申请号: US10433938申请日: 2003-06-06
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公开(公告)号: US20040020046A1公开(公告)日: 2004-02-05
- 发明人: Takeshi Suzuki , Satoru Tomekawa , Yosihiro Tomita , Yuichiro Sugita , Shigeru Yamane
- 优先权: JP2001-242858 20010809
- 主分类号: H05K003/10
- IPC分类号: H05K003/10 ; H01M002/16
摘要:
The present invention provides a method for manufacturing a conductive paste. The method includes deforming conductive particles so that a deformation degree is 1.01 to 1.5 by application of a stress to the conductive particles and mixing the deformed conductive particles with a binder that includes a thermosetting resin as the main component. The deformation degree is determined by dividing an average diameter of the conductive particles after deformation by an average diameter of the conductive particles before deformation, where the average diameter is measured by a laser diffraction method. The use of this conductive paste for a prepreg sheet having limited compressibility can suppress a short circuit between via holes and the degradation of insulation properties.