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    Transparent substrate provided with electroconductive strips
    2.
    发明申请
    Transparent substrate provided with electroconductive strips 有权
    带有导电条的透明基板

    公开(公告)号：US20040031146A1

    公开(公告)日：2004-02-19

    申请号：US10257439

    申请日：2003-07-07

    发明人： Dieter Hahn ,  Josef Switalla ,  Rainer Kummutat ,  Andre Beyrle ,  Yannick Lebail

    IPC分类号： H05K003/02 ,  H05K003/10

    CPC分类号： H05K1/092 ,  H01B1/16 ,  H01B1/22 ,  H05B3/84 ,  H05B2203/002 ,  H05B2203/017 ,  H05K1/0306 ,  H05K3/1216 ,  H05K2201/0108 ,  Y10T29/49155

    摘要： The present invention relates to a method of manufacturing electrically conducting tracks on a transparent substrate, by screen printing with an electrically conducting paste, and to the transparent substrate provided with said tracks. According to the invention, conducting tracks are formed with a width less than or equal to 0.3 mm by applying, by screen printing, a thixotropic electrically conducting paste having a ratio of the viscosity without shear stress to the viscosity under shear stress under screen-printing conditions of at least 50 and having a silver content greater than 35% and of which at least 98% of the particles which form it have a size less than 25 nullm, by means of a screen having at least 90 threads per cm, the coating of said screen being provided with slots, the narrowest width of which is equal to 0.25 mmnull0.05 mm, and by subjecting said tracks to baking.

    摘要翻译： 本发明涉及通过使用导电糊的丝网印刷以及设置有所述轨道的透明基板在透明基板上制造导电轨道的方法。 根据本发明，通过丝网印刷通过丝网印刷施加具有无剪切应力的粘度比的触变性导电糊在丝网印刷下的剪切应力下的粘度，形成宽度小于或等于0.3mm的导电轨道 至少为50，并且银含量大于35％的条件，其中至少98％的形成颗粒的颗粒具有小于25μm的尺寸，通过具有至少90个螺纹/ cm的筛网，涂层 所述屏幕设置有槽，其最窄宽度等于0.25mm±0.05mm，并且通过对所述轨道进行烘烤。

    Production method of printed circuit board
    3.
    发明申请
    Production method of printed circuit board 有权
    印刷电路板的生产方法

    公开(公告)号：US20030172526A1

    公开(公告)日：2003-09-18

    申请号：US10385172

    申请日：2003-03-10

    申请人： Nitto Denko Corporation

    发明人： Makoto Komatsubara ,  Yasuhito Ohwaki ,  Takeshi Yoshimi ,  Shigenori Morita

    IPC分类号： H05K003/10 ,  H05K003/20

    CPC分类号： H05K3/108 ,  H05K1/056 ,  H05K3/064 ,  H05K3/205 ,  H05K3/44 ,  H05K2201/09781 ,  H05K2203/0323 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158

    摘要： The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a dummy pattern. The present invention is characterized in that an insulating layer 2 is formed in a given pattern on one surface of a supporting substrate 1, a circuit pattern 6 is formed on the insulating layer 2 while forming a dummy pattern 7 in an area free of the insulating layer 2 on the one surface of the supporting substrate 1, and an unnecessary part of the supporting substrate 1, which is free of the insulating layer 2 and the circuit pattern 6, is removed by dissolution together with the dummy pattern 7.

    摘要翻译： 本发明提供一种具有电路图案的印刷电路板的制造方法，该电路图案在低成本下具有小的厚度变化，而没有用于去除虚拟图案的特殊步骤。 本发明的特征在于，在支撑基板1的一个表面上以给定的图案形成绝缘层2，在绝缘层2上形成电路图案6，同时在没有绝缘层的区域中形成虚设图案7 在支撑基板1的一个表面上的层2，并且不存在绝缘层2和电路图案6的支撑基板1的不需要的部分通过与虚设图案7一起溶解而被去除。

    Method for manufacturing piezo-electric vibrator
    4.
    发明申请
    Method for manufacturing piezo-electric vibrator 失效
    制造压电振子的方法

    公开(公告)号：US20030154584A1

    公开(公告)日：2003-08-21

    申请号：US10358860

    申请日：2003-02-05

    发明人： Kiyoshi Aratake ,  Masayoshi Shiraishi

    IPC分类号： H04R017/00 ,  H05K003/10

    CPC分类号： H04R17/00 ,  H03H3/04 ,  H03H2003/0478 ,  Y10T29/42 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A piezo-electric vibrator having an electrode structure enabling to avoid unevenness of junction is to be provided. Plural electrode patterns 160 consisting of a pair of exciting electrode films 80 and 81 formed on a crystal vibrator 110 and frame electrodes 38 and 39 formed on each frame-shaped portion 100 and connected to a pair of exciting electrode films 80 and 81 are formed, and course adjusting of frequency is carried out. After that, plural electrode patterns consisting of a pair of exciting electrodes 80 and 81 formed on each crystal vibrator piece 110 and joining films 40 and 41 formed on each frame-shaped portion 100 and connected to the pair of exciting electrode films 80 and 81 in which each of them is shorted is formed on a crystal wafer 130 forming plural vibrators 20 consisting of the crystal vibrator piece 110 and the frame-shaped portion 100 again so as to carry out anode junction by making applying voltage possible.

    摘要翻译： 提供具有能够避免结的不均匀性的电极结构的压电振动器。 形成由形成在晶体振子110上的一对激励电极膜80和81以及形成在每个框状部分100上并连接到一对激励电极膜80和81上的框电极38和39组成的多个电极图案160， 并进行频率的调整。 之后，形成在形成在各个晶体振子片110上的一对激励电极80和81以及形成在每个框状部分100上并连接到一对激励电极膜80和81上的接合膜40和41的多个电极图案 它们中的每一个被短路形成在晶体晶片130上，再次形成由晶体振子片110和框状部分100组成的多个振动器20，以通过施加电压来执行阳极结。

    A PROCESS FOR MANUFACTURING A FLAT COIL
    5.
    发明申请
    A PROCESS FOR MANUFACTURING A FLAT COIL 失效
    制造扁平线圈的方法

    公开(公告)号：US20030088970A1

    公开(公告)日：2003-05-15

    申请号：US09992517

    申请日：2001-11-14

    申请人： Headway Technologies, Inc.

    发明人： Jei-Wei Chang ,  Kochan Ju

    IPC分类号： H05K003/10 ,  H04R031/00

    CPC分类号： H05K3/108 ,  H01F17/0006 ,  H01F41/043 ,  H05K1/165 ,  H05K3/062 ,  H05K3/388 ,  H05K2203/0315 ,  H05K2203/0361 ,  H05K2203/095 ,  H05K2203/1142 ,  Y10T29/49032 ,  Y10T29/49069 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A process for manufacturing a flat coil for use as the write head in a magnetic disk system is disclosed. The process starts with a blanket seed layer which is coated with a photoresist frame that defines the shape of the coil. The latter is then electroformed from the seed layer within the confines of said frame. Key features of the invention include capping the coil with a layer of gold to protect it during the removal of copper that is exposed after photoresist removal, using reactive ion etching to convert the exposed copper to the chloride (which is then easily rinsed away), and then removing all last traces of chlorides through an ashing process.

    摘要翻译： 公开了一种用于制造用作磁盘系统中的写入头的扁平线圈的工艺。 该工艺以覆盖有限定线圈形状的光致抗蚀剂框架的覆盖种子层开始。 然后将后者从所述框架的范围内的种子层电铸。 本发明的主要特征包括用一层金覆盖线圈，以在去除在光致抗蚀剂去除之后暴露的铜中保护它，使用反应离子蚀刻将暴露的铜转化为氯化物（然后容易地冲洗掉） 然后通过灰化过程去除所有最后痕量的氯化物。

    Ceramic electronic component and method of producing the same
    8.
    发明申请
    Ceramic electronic component and method of producing the same 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20030007314A1

    公开(公告)日：2003-01-09

    申请号：US10107099

    申请日：2002-03-26

    发明人： Yukio Sanada ,  Yoshinori Saito

    IPC分类号： H01G007/00 ,  H01G004/228 ,  H05K003/10

    CPC分类号： H01G4/248 ,  C23C18/1865 ,  C23C18/1882 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T428/31663

    摘要： A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains a ceramic member, and terminal electrodes formed on both of end-faces of the ceramic member. Each terminal electrode comprises an external electrode, and a plating coat formed thereon. To produce the ceramic electronic component, the ceramic member having the external electrodes are dipped into a water-repelling agent, dried, and plated. The water-repelling agent contains a functional group which is readily adsorbed to the external electrodes and a hydrophobic functional group.

    摘要翻译： 提供一种陶瓷电子部件，其具有没有电镀侵入的陶瓷部件，以及制造陶瓷电子部件的陶瓷电子部件的制造方法。 陶瓷电子部件包含陶瓷部件和形成在陶瓷部件的两个端面上的端子电极。 每个端子电极包括外部电极和形成在其上的镀覆层。 为了制造陶瓷电子部件，将具有外部电极的陶瓷部件浸入防水剂中，干燥并电镀。 防水剂含有容易吸附到外部电极和疏水官能团的官能团。

    High-density electronic circuits
    9.
    发明申请
    High-density electronic circuits 失效
    高密度电子电路

    公开(公告)号：US20030006067A1

    公开(公告)日：2003-01-09

    申请号：US09899507

    申请日：2001-07-03

    申请人： Max Levy Autograph, Inc

    发明人： Donald C. Sedberry

    IPC分类号： H05K003/20 ,  H05K003/10 ,  B23P019/00

    CPC分类号： H05K3/1258 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/107 ,  H05K3/1225 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/0726 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/532

    摘要： A high-density circuit has a plurality of conductors formed in grooves in a ceramic substrate, the conductors having a height less than that of the walls of the grooves. The substrate is embossed with a pattern of grooves corresponding to the grooves in an electroform made from a master tool. The same master tool is used to form a stencil which mates with the grooved substrate. A cermet paste is pushed through the stencil, so as to fill the bottom region of the grooves, and the stencil is then removed, leaving only the paste at the bottom of the grooves. The substrate is then fired, causing the substrate to harden, and causing the cermet to become conductive and to become firmly bonded to the substrate. Because the stencil and the substrate are made from the same, or replications of the same, master tool, the cermet paste can be laid down with great precision, thus enhancing the quality of the product, and reducing the cost of its manufacture.

    摘要翻译： 高密度电路具有形成在陶瓷基板的凹槽中的多个导体，导体的高度小于凹槽壁的高度。 在由主工具制成的电铸中，对基板进行凹槽对应凹槽的图案压印。 使用相同的主工具形成与沟槽基板相配合的模版。 将金属陶瓷膏推入模板中，以便填充凹槽的底部区域，然后移除模版，仅留下凹槽底部的糊状物。 然后烧制基板，导致基板硬化，并使金属陶瓷变得导电并且牢固地结合到基板上。 由于模板和基板由相同的主工具制成，也可以复制主工具，所以可以高精度地放置金属陶瓷糊，从而提高产品的质量，降低其制造成本。