Invention Application
US20040028894A1 Bonding structure having protrusions 失效
具有凸起的粘合结构

  • Patent Title: Bonding structure having protrusions
  • Patent Title (中): 具有凸起的粘合结构
  • Application No.: US10630841
    Application Date: 2003-07-31
  • Publication No.: US20040028894A1
    Publication Date: 2004-02-12
  • Inventor: Masato UenoYoshifumi Watanabe
  • Priority: JP2002-230356 20020807
  • Main IPC: B32B023/02
  • IPC: B32B023/02
Bonding structure having protrusions
Abstract:
A first body is bonded with a second body to accommodate a sensor element therein. An annular convexity is formed at either the first body or the second body along with its peripheral end border. On the other of the first body and the second body, an annular concavity is formed to engage with the convexity. The convexity engages with the concavity to form an inner gap and an outer gap. Glue is filled in the inner gap and the outer gap. The peripheral surface of the convexity and the peripheral surface of the concavity, where the glue is bonded, have plural protrusions.
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