发明申请
- 专利标题: Semiconductor device and manufacturing the same
- 专利标题(中): 半导体器件和制造相同
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申请号: US10420740申请日: 2003-04-23
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公开(公告)号: US20040065900A1公开(公告)日: 2004-04-08
- 发明人: Yasunari Umemoto , Hideyuki Ono , Tomonori Tanoue , Yasuo Ohsone , Isao Ohbu , Chushiro Kusano , Atsushi Kurokawa , Masao Yamane
- 申请人: Hitachi, Ltd.
- 申请人地址: null
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: null
- 优先权: JP2002-160432 20020531
- 主分类号: H01L031/072
- IPC分类号: H01L031/072
摘要:
The invention is directed to improve resistance to destruction of a semiconductor device. A protection circuit having a plurality of bipolar transistors which are Darlington connected between outputs (collector and emitter) of an amplification circuit of a high output is electrically connected in parallel with the amplification circuit. The amplification circuit has a plurality of unit HBTs (Heterojunction Bipolar Transistors) which are connected in parallel with each other. The protection circuit has a two-stage configuration including a first group of a protection circuit having a plurality of bipolar transistors Q1 to Q5 and a second group of a protection circuit having a plurality of bipolar transistors.
公开/授权文献
- US07045877B2 Semiconductor protection device 公开/授权日:2006-05-16
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