发明申请
US20040077200A1 Electronic component testing socket and electronic component testing apparatus using the same
失效
电子元器件测试插座和使用该插座的电子元器件测试仪器
- 专利标题： Electronic component testing socket and electronic component testing apparatus using the same
- 专利标题（中）： 电子元器件测试插座和使用该插座的电子元器件测试仪器
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申请号： US10455800申请日： 2003-06-06
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公开(公告)号： US20040077200A1公开(公告)日： 2004-04-22
- 发明人: Takaji Ishikawa , Hiroto Nakamura
- 优先权： JP2000-373614 20001207; JP2001-049495 20010223
- 主分类号： H01R004/64
- IPC分类号： H01R004/64
摘要：
To control the temperature of an electronic component testing socket without mixing any noise into a test signal to be applied to an electronic component and a respond signal to be read from the electronic component when conducting a test on the electronic component, a first space 67 in the electronic component testing socket base 6 and a socket body inside space 75 in the electronic component testing socket 7 are connected via a gas outlet 65 and a gas inlet 76, and a second space 68 in the electronic component testing socket base 6 and a socket body inside space 75 in the electronic component testing socket 7 are connected via a gas inlet 66 and a gas outlet 77.
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