发明申请
- 专利标题: Ionic additives for extreme low dielectric constant chemical formulations
- 专利标题(中): 用于极低介电常数化学配方的离子添加剂
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申请号: US10636517申请日: 2003-08-07
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公开(公告)号: US20040087184A1公开(公告)日: 2004-05-06
- 发明人: Robert P. Mandal , Alexandros T. Demos , Timothy Weidman , Michael P. Nault , Nikolaos Bekiaris , Scott J. Weigel , Lee A. Senecal , James E. Mac Dougall , Hareesh Thridandam
- 申请人: APPLIED MATERIALS INC., A Delaware corporation , AIR PRODUCTS AND CHEMICALS INC., A Delaware Corporation
- 申请人地址: CA Santa Clara PA Allentown
- 专利权人: APPLIED MATERIALS INC., A Delaware corporation,AIR PRODUCTS AND CHEMICALS INC., A Delaware Corporation
- 当前专利权人: APPLIED MATERIALS INC., A Delaware corporation,AIR PRODUCTS AND CHEMICALS INC., A Delaware Corporation
- 当前专利权人地址: CA Santa Clara PA Allentown
- 主分类号: H01L021/31
- IPC分类号: H01L021/31 ; H01L021/469
摘要:
A process for depositing porous silicon oxide-based films using a sol-gel approach utilizing a precursor solution formulation which includes a purified nonionic surfactant and an additive among other components, where the additive is either an ionic additive or an amine additive which forms an ionic ammonium type salt in the acidic precursor solution. Using this precursor solution formulation enables formation of a film having a dielectric constant less than 2.5, appropriate mechanical properties, and minimal levels of alkali metal impurities. In one embodiment, this is achieved by purifying the surfactant and adding ionic or amine additives such as tetraalkylammonium salts and amines to the stock precursor solution.
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