A microstructure component is proposed, in particular an encapsulated micromechanical sensor element, at least one microstructure (18), especially patterned out from a silicon layer (14), being encapsulated by a glass element (51). It is further provided that at least the region of the glass element (51) covering the microstructure (18) is furnished with an electrically conductive coating (50) on its side facing the microstructure (18).