公开(公告)号：US20040245318A1

公开(公告)日：2004-12-09

申请号：US10491795

申请日：2004-07-27

Inventor： Claes Tornberg

IPC: B23K001/00

CPC classification number: B22F9/082 ,  B22F2009/088

Abstract: The invention relates to the production of a metallic powder consisting of surface-fissured, so-called irregular particles, namely a water-atomised metallic powder. The aim of the invention is to obtain an irregular surface form of powder grains (23) in a narrow weight class and to impart a high porosity with a homogeneous distribution to the sintered body. To this end, in a first step, the pouring stream (2) is deviated in its flow direction and is enlarged on its surface, and in a second step, the surface-enlarged pouring stream (21) is deviated again its flow direction and is divided, and the liquid metallic particles (22) formed are accelerated, and in a third step, the displaced liquid metallic particles (22) are applied and divided, at an angle null of between 10 and 90null in relation to the displacement direction of the same, with a high speed current (51) formed at least partially from a liquid medium, and the particles (23) are then solidified. According to one embodiment of the invention, in order to reduce the overheating of the metal melt and/or to improve the quality of the metallic powder produced, the pouring stream (2) is deviated in its flow direction and a surface enlargement of the same (21) is carried out, in a first method step, and/or the surface-enlarged pouring stream (21) is deviated and divided, and the formed liquid metallic particles (22) are accelerated, in the second method step, with at least one current (6,31,41) formed from at least one heated gas or heated gas mixture.

Abstract translation: 本发明涉及由表面裂开的所谓的不规则颗粒，即水雾化的金属粉末组成的金属粉末的制造。 本发明的目的是获得一种不规则表面形式的粉末颗粒（23），并且赋予烧结体均匀分布的高孔隙率。 为此，在第一步骤中，倾倒料流（2）在其流动方向上偏离并在其表面上扩大，在第二步骤中，表面膨胀的浇注料流（21）再次偏离其流动方向， 并且形成的液体金属颗粒（22）被加速，并且在第三步骤中，移位的液体金属颗粒（22）相对于位移方向以10至90°的角度γ被施加和分割 使用至少部分地从液体介质形成的高速电流（51），然后使颗粒（23）固化。 根据本发明的一个实施例，为了减少金属熔体的过热和/或提高所生产的金属粉末的质量，浇注料流（2）在其流动方向上偏离并且其表面扩大 （21）在第一方法步骤中和/或表面增大的浇注料流（21）偏离和分离，并且在第二方法步骤中，形成的液态金属颗粒（22）被加速 由至少一种加热的气体或加热气体混合物形成的至少一个电流（6,31,41）。

公开(公告)号：US20040238510A1

公开(公告)日：2004-12-02

申请号：US10814479

申请日：2004-03-31

Inventor： Karl-Heinz Mielke

IPC: B23K001/00

CPC classification number: F16B37/061 ,  B23K1/00 ,  B23K1/0008 ,  B23K35/0288

Abstract: The method according to the invention of connecting a metal fastening element (1) to a metal workpiece (5), wherein the fastening element (1) comprises a carrier (2), which carries a solder material (3), to which the carrier (2) is connected in an electrically conductive manner, comprises the following process steps: the solder material (3) is introduced into an indentation (8) in the carrier (2) and provided with a convex contour (4) directed towards the workpiece (5) to be soldered; a voltage is applied between the fastening element (1) and the workpiece (5) so an electrical arc (6) between solder material (3) and workpiece (5) effects a selective melting-on of the solder material (3); the fastening element (1) is pressed against the workpiece (5). The method as well as the fastening element (1), which is suitably designed for said method with a contour (4) of the solder material (3) directed towards the workpiece (5) to be soldered, is notable for the fact that a local, selective melting of the solder material (3) is achieved and unnecessary thermal loading of surrounding regions is avoided. Thus, a particularly stable solder joint is achieved between fastening element (1) and workpiece (5).

Abstract translation: 根据本发明的将金属紧固元件（1）连接到金属工件（5）上的方法，其中紧固元件（1）包括承载焊料（3）的载体（2），载体 （2）以导电方式连接，包括以下工艺步骤：焊料材料（3）被引入载体（2）中的凹陷（8）中并且具有指向工件的凸形轮廓（4） （5）待焊接; 在紧固元件（1）和工件（5）之间施加电压，使得焊料材料（3）和工件（5）之间的电弧（6）实现焊料材料（3）的选择性熔化; 紧固元件（1）被压靠在工件（5）上。 该方法以及针对所述方法适当设计的紧固元件（1），其具有指向要焊接的工件（5）的焊料材料（3）的轮廓（4），这是因为以下事实是显着的： 实现焊料材料（3）的局部选择性熔化，避免了周围区域的不必要的热负荷。 因此，在紧固元件（1）和工件（5）之间实现特别稳定的焊接接头。

公开(公告)号：US20040200877A1

公开(公告)日：2004-10-14

申请号：US10410081

申请日：2003-04-09

Applicant: Visteon Global Technologies, Inc.

Inventor： Lakhi Nandlal Goenka

IPC: B23K001/00

CPC classification number: F27B9/00 ,  F27B9/10 ,  F27B9/24 ,  F27B9/36 ,  F27D5/0012 ,  F27D9/00 ,  F27D2009/0075

Abstract: A solder reflow oven comprises a reflow zone for heating a workpiece using heated air to a temperature effective to reflow solder. The reflow zone comprises a nozzle having divergent vanes that direct shear layers into neighboring zones to extend the distance over which the workpiece is heated to effective solder reflow temperatures.

Abstract translation: 回流焊炉包括用于使用加热的空气将工件加热到有效回流焊料的温度的回流区。 回流区包括具有发散叶片的喷嘴，其将剪切层引导到相邻区域中，以将加工工件的距离延伸到有效的回流焊温度。

公开(公告)号：US20040129756A1

公开(公告)日：2004-07-08

申请号：US10398788

申请日：2003-06-20

Inventor： Elke Zakel ,  Paul Kasulke ,  Oliver Uebel ,  Lars Titerle

IPC: B23K001/00

CPC classification number: B23Q17/24 ,  B23K3/0607 ,  B23K3/08 ,  B23Q3/18 ,  B23Q15/225 ,  B23Q17/2233 ,  G05B2219/37555 ,  G05B2219/50353

Abstract: The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spatial axis (y), the other (11) being oriented essentially vertically with respect to a surface (8) of the workpiece.

Abstract translation: 相对于工件（6）定位工具（1）的装置通过两个照相机（10,11）相对于三个空间轴（x，y，z）控制驱动器（2,3,4），第一 （1）基本沿着空间轴线（y）拍摄图像，另一个（11）相对于工件的表面（8）基本上垂直取向。

公开(公告)号：US20040112937A1

公开(公告)日：2004-06-17

申请号：US10416140

申请日：2003-10-08

Inventor： Franz Laermer

IPC: B23K001/00

CPC classification number: B81B7/0064 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A microstructure component is proposed, in particular an encapsulated micromechanical sensor element, at least one microstructure (18), especially patterned out from a silicon layer (14), being encapsulated by a glass element (51). It is further provided that at least the region of the glass element (51) covering the microstructure (18) is furnished with an electrically conductive coating (50) on its side facing the microstructure (18).

Abstract translation: 提出了微结构组件，特别是封装的微机械传感器元件，特别是从硅层（14）图案化的至少一个微结构（18）被玻璃元件（51）封装。 进一步地，至少覆盖微结构（18）的玻璃元件（51）的区域在其面向微结构（18）的一侧设置有导电涂层（50）。

公开(公告)号：US20040094517A1

公开(公告)日：2004-05-20

申请号：US10363097

申请日：2003-06-12

Inventor： Volker Arndt ,  Klaus Offterdinger ,  Walter Pasdzior

IPC: B23K011/24 ,  B23K001/00

CPC classification number: G01N29/4472 ,  B23K11/241 ,  B23K11/252 ,  G01N29/38 ,  G01N29/4427 ,  G01N2291/015 ,  G01N2291/048 ,  G01N2291/102 ,  G01N2291/2672

Abstract: The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area (18, 21, 22) is subjected to the action of ultrasonic waves, preferably to the action of shear waves, by using an ultrasound source (14). During a first welding process (n1), a signal processing (30)) determines a first ultrasonic permeability (Dn1) from a received ultrasonic signal (UE). During at least one subsequent welding process (n2), a second ultrasonic permeability (Dn2) is determined from an ultrasonic signal (UE) that is received during a renewed exposure of the welding area (18, 21, 22) to ultrasonic waves. A display (32) and/or a diagnostic function and/or a correction of control quantities of the welding system is/are carried out as a function of the at least two ultrasonic permeabilities (Dn1, Dn2).

Abstract translation: 本发明涉及一种用于确定焊接系统参数的装置和方法。 根据本发明，通过使用超声波源（14），焊接区域（18,21,22）受到超声波的作用，优选地受到剪切波的作用。 在第一焊接过程（n1）期间，信号处理（30））从接收到的超声波信号（UE）确定第一超声波透过率（Dn1）。 在至少一个随后的焊接过程（n2）期间，从在焊接区域（18,21,22）再次暴露于超声波期间接收的超声波信号（UE）确定第二超声波透过率（Dn2）。 作为至少两个超声波渗透性（Dn1，Dn2）的函数执行显示器（32）和/或诊断功能和/或焊接系统的控制量的校正。

公开(公告)号：US20040011855A1

公开(公告)日：2004-01-22

申请号：US10363167

申请日：2003-03-05

Inventor： Kei Nakamura ,  Satoshi Tanigawa ,  Shinya Oota

IPC: B23K001/00

CPC classification number: H05K3/462 ,  H05K3/4038 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/09536 ,  H05K2203/0425 ,  Y10T156/10

Abstract: A method of producing a multilayer wired circuit board that can provide sufficient adhesion strength of the interface between a conductor layer and a thermosetting adhesive layer laminated, to provide improvement in connection strength between the conductor layers and thus improvement in reliability. In this method, after a thermosetting adhesive layer is formed on a first conductor layer, an opening is formed in the thermosetting adhesive layer and solder powders are charged in the opening at normal temperature. Sequentially, a second conductor layer is formed on the thermosetting adhesive layer including the opening filled with the solder powders. Thereafter, the solder powders are melted by heating, to electrically connect between the first conductor layer and the second conductor layer.

Abstract translation: 一种多层布线电路板的制造方法，其能够提供层叠的导体层和热固性粘合层之间的界面的充分的粘合强度，以提高导体层之间的连接强度，从而提高可靠性。 在该方法中，在第一导体层上形成热固性粘合剂层之后，在热固性粘合剂层中形成开口，并且在常温下在开口中填充焊料粉末。 接着，在包含填充有焊料粉末的开口的热固性粘合剂层上形成第二导体层。 此后，通过加热熔化焊料粉末，以电连接第一导体层和第二导体层之间。

公开(公告)号：US20040011854A1

公开(公告)日：2004-01-22

申请号：US10388527

申请日：2003-03-17

Applicant: AU Optronics Corp.

Inventor： Chao-Min Wu

IPC: B23K001/00

CPC classification number: H01L21/67109 ,  F23M7/00 ,  F27D1/18

Abstract: A shutter structure of an oven apparatus used in semiconductor or liquid crystal display (LCD) processes includes a hollow housing and an open device, wherein the housing has a front face, a first face, a second face and a rear face whose edges of two sides are respectively connected with one respective side edge of the first face and the second face, and the front face is opposite to the rear face and is structurally separable at least with the first face and with the second face, and the open device includes a rotating shaft which is disposed at one side of the front face and a driver which is disposed at one end of the rotating shaft and used to drive the front face of the shutter to open rotatedly so as to have a substrate placed into the housing and taken out from the housing.

Abstract translation: 在半导体或液晶显示（LCD）工艺中使用的烤箱装置的快门结构包括中空壳体和开放装置，其中壳体具有前表面，第一面，第二面和后表面，其两边缘 侧分别与第一面和第二面的一个相应的侧边缘连接，并且前表面与后表面相对，并且在结构上可以至少与第一面和第二面分开，并且打开装置包括一个 旋转轴，其设置在前表面的一侧，驱动器设置在旋转轴的一端，用于驱动活门的前表面旋转地旋转，以便具有放置在壳体中的基板 从房屋出来。

公开(公告)号：US20030222123A1

公开(公告)日：2003-12-04

申请号：US10401044

申请日：2003-03-28

Inventor： Masayuki Tsuchiya ,  Hiroaki Ueno ,  Yasushi Fujinaga ,  Chiaki Ushigome ,  Susumu Nishikawa

IPC: B23K001/00

CPC classification number: B22D11/143 ,  B22D11/00 ,  B22D17/007

Abstract: A billet for a thixocasting process and a thixocasting process using the billet allows casting using a thixocasting process to be realized at low production cost without permeation of an oxide film to the inside of the billet in injection molding. In a billet used for a thixocasting process continuously cast by intermittently drawing out, the interval of the oscillation marks is 10 mm or less and the maximum tilt angle of the oscillation marks relative to a cross section which is at a right angle to the drawing out direction is 45null or less.

Abstract translation: 用于触变工艺的坯料和使用该坯料的触变工艺允许使用触媒工艺进行铸造，以低生产成本实现，而不会在注射成型中将氧化膜渗透到坯料的内部。 在用于通过间歇抽出连续铸造的触媒处理的坯料中，振动标记的间隔为10mm以下，振动标记相对于与拉拔成直角的截面的最大倾斜角 方向为45°以下。

公开(公告)号：US20030178394A1

公开(公告)日：2003-09-25

申请号：US10346637

申请日：2003-01-17

Inventor： William A. Johnson

IPC: B23K001/00

CPC classification number: B23K1/0053 ,  B23K2101/32

Abstract: An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.

Abstract translation: 电连接器通过使用红外线辐射加热装置的一层焊料的辐射加热焊接或固定到车窗玻璃板的导电元件上。 加热装置可以包括红外灯和反射器，其用于将来自灯的辐射能引导到通常对应于电连接器和导电元件之间的焊料层的位置的目标区域。 加热装置可操作以将焊料层快速且基本上加热到期望的温度以熔化焊料层，同时基本上限制将热量导向玻璃板。 电连接器可以固定在车辆或模块化的窗户组装工厂，使得玻璃板可以从玻璃制造厂运输到车辆或模块化的窗户组装设备，而无需电连接器。