Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof

Invention Application

US20040121704A1 Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof 有权

Title translation: 具有枢转机构的垂直可调化学机械抛光头及其使用方法

Patent Title: Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
Patent Title (中): 具有枢转机构的垂直可调化学机械抛光头及其使用方法
Application No.: US10700984

Application Date: 2003-11-04
Publication No.: US20040121704A1

Publication Date: 2004-06-24
Inventor: Kunihiko Sakurai , Gerard Moloney , Huey-Ming Wang , Jun Liu , Peter Lao
Applicant: Ebara Technologies Incorporated
Applicant Address: CA Sacramento
Assignee: Ebara Technologies Incorporated
Current Assignee: Ebara Technologies Incorporated
Current Assignee Address: CA Sacramento
Main IPC: B24B049/00
IPC: B24B049/00 ; B24B051/00

Abstract:

The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.

Abstract(Chinese):

本发明提供了一种具有枢转机构和方法的可垂直调节的化学机械抛光头。

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