发明申请
- 专利标题: Multibeam laser drilling apparatus
- 专利标题(中): 多波束激光钻孔设备
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申请号: US10740817申请日: 2003-12-22
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公开(公告)号: US20040129685A1公开(公告)日: 2004-07-08
- 发明人: Kunio Arai , Kenji Suzuki
- 申请人: HITACHI VIA MECHANICS, LTD.
- 申请人地址: JP Ebina-shi
- 专利权人: HITACHI VIA MECHANICS, LTD.
- 当前专利权人: HITACHI VIA MECHANICS, LTD.
- 当前专利权人地址: JP Ebina-shi
- 优先权: JP2002-377578 20021226; JP2003-149510 20030527
- 主分类号: B23K026/38
- IPC分类号: B23K026/38 ; B23K026/067
摘要:
Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an fnull lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the fnull lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.
公开/授权文献
- US06849824B2 Multibeam laser drilling apparatus 公开/授权日:2005-02-01
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