Invention Application
- Patent Title: Lapping apparatus and lapping method
- Patent Title (中): 研磨装置和研磨方法
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Application No.: US10772593Application Date: 2004-02-06
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Publication No.: US20040157530A1Publication Date: 2004-08-12
- Inventor: Masahiro Omata , Masahiko Iizumi , Kiyoshi Hasegawa , Takashi Ogino , Tomohiro Kondo , Kazuo Takeda , Takafumi Watanabe , Yoshiyuki Chida , Yasushi Matsushita
- Applicant: NISSAN MOTOR, CO., LTD.
- Applicant Address: null
- Assignee: NISSAN MOTOR, CO., LTD.
- Current Assignee: NISSAN MOTOR, CO., LTD.
- Current Assignee Address: null
- Priority: JP2003-034064 20030212; JP2003-034088 20030212; JP2003-036701 20030214; JP2003-058964 20030305; JP2003-058954 20030305; JP2003-066595 20030312
- Main IPC: B24B049/00
- IPC: B24B049/00 ; B24B051/00 ; B24B021/00
Abstract:
A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film(1), a shoe set handler (40) handles the shoe set (2) to press the film (1) against the work (W), and a deterioration delayer (C) is configured to delay an abrasivity deterioration of the film (1).
Public/Granted literature
- US07413498B2 Lapping apparatus and lapping method Public/Granted day:2008-08-19
Information query
