Polishing silicon wafers
    1.
    发明申请
    Polishing silicon wafers 有权
    抛光硅片

    公开(公告)号:US20040087262A1

    公开(公告)日:2004-05-06

    申请号:US10689678

    申请日:2003-10-22

    Inventor: Walter Dudovicz

    CPC classification number: B24B37/205 B24B21/04 B24B37/26 B24D11/06

    Abstract: An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.

    Abstract translation: 用于带式抛光机的环形带包括支撑织物和相对低硬度的聚合物层。 聚合物层形成有排水槽。 支撑织物可以包括非织造或编织材料或具有取向增强纱线的膜。 另一版本包括支撑承载聚合物层的机织或非编织层的螺旋链节织物。 聚合物层可以是双层,其上部比下层更硬或更软。

    Chamfer processing method and device for plate material
    2.
    发明申请
    Chamfer processing method and device for plate material 失效
    倒角加工方法和板材装置

    公开(公告)号:US20040005846A1

    公开(公告)日:2004-01-08

    申请号:US10446118

    申请日:2003-05-28

    Applicant: JATCO Ltd.

    CPC classification number: F16G5/16 B24B9/00 B24B19/26 B24B21/002 B24B47/04

    Abstract: Chamfer processing is carried out by making plate material W end faces come in contact with rotating grinding belts. The grinding surfaces of the opposing side by side grinding belts are on the centerline in the thickness direction of the plate material. The center point is considered the pivot point as seen from the plate material end faces and in distance is smaller than the thickness of the plate material. Pivot motion of the plate material is carried out in the rotating direction of grinding belts. This chamfer processing method and device enables chamfer in a small curvature radius without applying a heavy tension load on grinding belts, and performs uniform deep chamfer processing of multiple plate material simultaneously.

    Abstract translation: 通过使板材W端面与旋转的研磨带接触来进行倒角加工。 相对的并排研磨带的磨削表面在板材的厚度方向上的中心线上。 中心点被认为是从板材端面看的枢轴点,距离小于板材的厚度。 板材的枢轴运动沿研磨带的旋转方向进行。 这种倒角加工方法和装置能够在小的曲率半径上进行倒角,而不会在研磨带上施加重的张力,同时对多个板材进行均匀的深倒角加工。

    Method for optimizing the planarizing length of a polishing pad
    3.
    发明申请
    Method for optimizing the planarizing length of a polishing pad 失效
    优化抛光垫平面化长度的方法

    公开(公告)号:US20020146966A1

    公开(公告)日:2002-10-10

    申请号:US09825643

    申请日:2001-04-04

    Inventor: Peter Renteln

    CPC classification number: B24B37/20 B24B21/04 B24B53/017 B24D15/04

    Abstract: A method for optimizing the planarizing length of a polishing pad is disclosed that includes forming a substantially constant network of islands and trenches into a first side of a polishing pad. The trenches are formed to a pre-determined distance apart. The polishing pad is fit to a chemical-mechanical polishing system. A surface layer of a semiconductor wafer is planarized with the first side of the polishing pad. Upon completion of the polishing process, the planarized wafer surface layer is observed. If the wafer surface layer is planarized to an amount outside of a set target polishing range, the distance between the trenches on the first side of the polishing pad is uniformly decreased. The above steps are repeated until the wafer surface layer is planarized to an amount within the set target polishing range.

    Abstract translation: 公开了一种用于优化抛光垫的平坦化长度的方法,其包括在抛光垫的第一侧中形成基本恒定的岛和沟槽网络。 沟槽形成为预定的距离。 抛光垫适合化学机械抛光系统。 半导体晶片的表面层与抛光垫的第一面平坦化。 抛光处理完成后,观察平面化的晶片表面层。 如果晶片表面层被平坦化到设定的目标抛光范围之外的量,则抛光垫的第一侧上的沟槽之间的距离被均匀地减小。 重复上述步骤,直到晶片表面层平坦化到设定的目标抛光范围内的量。

    Expandable wheel for supporting an endless abrasive belt
    4.
    发明申请
    Expandable wheel for supporting an endless abrasive belt 失效
    用于支撑无端砂带的可膨胀轮

    公开(公告)号:US20020127961A1

    公开(公告)日:2002-09-12

    申请号:US09745040

    申请日:2000-12-20

    CPC classification number: B24D9/02

    Abstract: An expandable wheel for supporting an endless abrasive belt. The present invention relates more particularly to an expandable wheel for supporting an endless abrasive belt, which includes an hub having an axis and a plurality of wheel segments engaged with the hub, where the hub and the plurality of wheel segments are adapted to rotate about the axis, and where the plurality of wheel segments are movable between a first radial position and a second radial position.

    Abstract translation: 用于支撑环形砂带的可扩展轮。 本发明更具体地涉及一种用于支撑环形磨带的可扩展轮,其包括具有轴线和与轮毂接合的多个轮段的轮毂,其中毂和多个车轮段适于围绕 并且其中所述多个轮段可在第一径向位置和第二径向位置之间移动。

    Linear reciprocating disposable belt polishing method and apparatus
    5.
    发明申请
    Linear reciprocating disposable belt polishing method and apparatus 失效
    线性往复式一次性皮带抛光方法和装置

    公开(公告)号:US20020123298A1

    公开(公告)日:2002-09-05

    申请号:US10136600

    申请日:2002-04-30

    CPC classification number: B24B37/245 B24B21/04 B24B37/26

    Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

    Abstract translation: 公开了一种用于化学机械平面化半导体晶片的设备,其具有连续的抛光带,第一侧具有固定的研磨表面和与第一侧相对的第二侧。 在一个实施例中,第一驱动辊保持抛光条的第一端,第二驱动辊保持抛光条的第二端,并且一对支撑辊在抛光的任一端接触抛光条的第二侧 带支撑。 驱动马达可操作地连接到第一和第二驱动辊,用于以线性双向的方式移动抛光条。

    Flex plate attachment for use with belt sanders
    6.
    发明申请
    Flex plate attachment for use with belt sanders 审中-公开
    柔性板附件,用于砂带机

    公开(公告)号:US20020086627A1

    公开(公告)日:2002-07-04

    申请号:US09753393

    申请日:2001-01-03

    CPC classification number: B24B21/02 B24B21/04 B24B21/18

    Abstract: A flex plate attachment is used on a variety of different belt sanders for abrading on or into contoured areas. The flex plate attachment will include a light duty scale for use on light duty belt sanders, and a heavy duty scale for use on commercial and industrial belt sanders. The flex plate works in conjunction with the function of the existing belt tensioning device within the belt sander and being attached onto the required mounts which allows the flex plate to function accordingly within the existing work area of the belt sander.

    Abstract translation: 柔性板附件用于各种不同的带式砂磨机,用于研磨或成型成轮廓区域。 柔性板附件将包括用于轻型砂带机的轻型刻度尺,以及用于商用和工业砂带机的重型标尺。 柔性板与带式打磨机内现有的皮带张紧装置的功能一起工作,并附着在所需的支架上,这允许柔性板在带式砂磨机的现有工作区域内相应地起作用。

    Method of and apparatus for manufacturing recording medium
    7.
    发明申请
    Method of and apparatus for manufacturing recording medium 失效
    记录介质的制造方法和装置

    公开(公告)号:US20020045411A1

    公开(公告)日:2002-04-18

    申请号:US09905443

    申请日:2001-07-13

    Inventor: Koichiro Kishima

    CPC classification number: B24B21/06 B24B1/00 G11B5/84

    Abstract: In a recording medium manufacturing method for obtaining a recording medium by effecting a surface smoothing treatment on a surface smoothing treatment surface of a surface of a medium, the surface smoothing treatment surface of the medium is locally pressed by a polishing work tape having a pressure area less than 1 mm, more preferably, less than 0.5 mm with respect to both radial direction and tangential direction relative to rotation of the medium. In a polishing work of recording medium manufacturing process, a problem of occurrence of defects such as scratches on the surface layer can be improved, whereby yield can be increased and mass-productivity can be improved.

    Abstract translation: 在通过对介质表面的平滑化处理表面进行表面平滑化处理来获得记录介质的记录介质制造方法中,介质的表面平滑处理表面被具有压力区域的抛光工作带局部地按压 相对于介质的旋转,相对于径向方向和切线方向小于1mm,更优选小于0.5mm。 在记录介质制造工序的研磨工序中,能够提高表面层上的划痕等缺陷的发生的问题,能够提高成品率,提高批量生产率。

    Support bodies and method for improving wear and tear on support bodies in large scale grinders
    8.
    发明申请
    Support bodies and method for improving wear and tear on support bodies in large scale grinders 审中-公开
    支撑体和改善大型磨床支撑体磨损的方法

    公开(公告)号:US20040147207A1

    公开(公告)日:2004-07-29

    申请号:US10474623

    申请日:2004-03-19

    CPC classification number: C23C4/02 B24B21/18 C23C4/06 C23C4/131

    Abstract: The invention relates to a method for improving wear and tear on support bodies (54) for plates or grinding belts in large-scale grinders (1). The support body (54) has a base body (18), onto which an abrasion-resistant primary layer of at least 0.3 mm thickness is applied using a thermal spraying process. This is configured as an inhomogeneous layer with an oxide entrapment of a specific porosity. If the support body (54) is a roll for the forward feed unit (20, 28), the roll body is roughened and a primer and the primary layer are applied using a thermal spraying process. Approximately 50% of the primary layer consists of chromium steel, in particular 13% chromium steel and an abrasion-resistant hard material and said primary layer provides a coarse surface with good grip that is resistant to wear and tear. If the support body (54) is a grinding-belt contact roll (9, 9null), the latter is polished after the thermal spraying process. If the support body (54) is a grinding belt shoe (50), the base body (18) is roughened and an adhesive layer and then the primary layer are applied in a thermal spraying process. The wear-resistant primary layer is polished to create a smooth surface and the layer construction is configured to produce a high degree of slip.

    Method and device for finishing surface of long material
    9.
    发明申请
    Method and device for finishing surface of long material 有权
    长材料表面处理方法及装置

    公开(公告)号:US20040023603A1

    公开(公告)日:2004-02-05

    申请号:US10332500

    申请日:2003-06-30

    Abstract: An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding the long material (W) by two or more elastic endless belts (1) with a specified force, rotating the elastic endless belts (1) in the same direction as or in the reverse direction to the moving direction of the long material by moving the long material (W) and increasing or decreasing the rotating speed of the elastic endless belts (1) more than or less than the moving speed of the long material, and loading powder and granular grinding material (S) between the elastic endless belts (1), characterized in that the grinding material (S) is moved relative to the long material (W) to rub the grinding material (S) against the long material (W) so as to finish the surface of the long material (W).

    Abstract translation: 一种能够防止任何环境问题发生的长材料(W)的表面和长材料的机械性能劣化的在线就绪方法,包括以下步骤:将长材料(W)保持两个或更多个 通过移动长材料(W)使弹性环形带(1)沿与长材料的移动方向相反的方向或相反方向旋转弹性环形带(1)并增加或减少 所述弹性环形带(1)的旋转速度大于或小于所述长材料的移动速度,并且在所述弹性环形带(1)之间装载粉末和颗粒磨料(S),其特征在于,所述研磨材料(S )相对于长材料(W)移动以将研磨材料(S)抵靠长材料(W)摩擦,以便完成长材料(W)的表面。

    Belt tensioning assembly for CMP apparatus

    公开(公告)号:US20040018808A1

    公开(公告)日:2004-01-29

    申请号:US10202196

    申请日:2002-07-24

    CPC classification number: B24B37/005 B24B21/20

    Abstract: A tensioning assembly for a polishing belt on a linear chemical mechanical polishing apparatus. The tensioning assembly comprises first and second rollers which are operably engaged by respective air cylinders and exert a selected degree of downward tension on the lower run of the horizontal polishing belt. A third roller biased typically by a spring pushes upwardly on the lower run of the belt between the first and second rollers. Accordingly, the first and second rollers, in conjunction with the third roller, tension the belt on the apparatus to maintain optimum material removal rates and uniformity. The degree of tension exerted on the belt can be varied according to stretching of the belt resulting from prolonged use.

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