Abstract:
An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.
Abstract:
Chamfer processing is carried out by making plate material W end faces come in contact with rotating grinding belts. The grinding surfaces of the opposing side by side grinding belts are on the centerline in the thickness direction of the plate material. The center point is considered the pivot point as seen from the plate material end faces and in distance is smaller than the thickness of the plate material. Pivot motion of the plate material is carried out in the rotating direction of grinding belts. This chamfer processing method and device enables chamfer in a small curvature radius without applying a heavy tension load on grinding belts, and performs uniform deep chamfer processing of multiple plate material simultaneously.
Abstract:
A method for optimizing the planarizing length of a polishing pad is disclosed that includes forming a substantially constant network of islands and trenches into a first side of a polishing pad. The trenches are formed to a pre-determined distance apart. The polishing pad is fit to a chemical-mechanical polishing system. A surface layer of a semiconductor wafer is planarized with the first side of the polishing pad. Upon completion of the polishing process, the planarized wafer surface layer is observed. If the wafer surface layer is planarized to an amount outside of a set target polishing range, the distance between the trenches on the first side of the polishing pad is uniformly decreased. The above steps are repeated until the wafer surface layer is planarized to an amount within the set target polishing range.
Abstract:
An expandable wheel for supporting an endless abrasive belt. The present invention relates more particularly to an expandable wheel for supporting an endless abrasive belt, which includes an hub having an axis and a plurality of wheel segments engaged with the hub, where the hub and the plurality of wheel segments are adapted to rotate about the axis, and where the plurality of wheel segments are movable between a first radial position and a second radial position.
Abstract:
An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.
Abstract:
A flex plate attachment is used on a variety of different belt sanders for abrading on or into contoured areas. The flex plate attachment will include a light duty scale for use on light duty belt sanders, and a heavy duty scale for use on commercial and industrial belt sanders. The flex plate works in conjunction with the function of the existing belt tensioning device within the belt sander and being attached onto the required mounts which allows the flex plate to function accordingly within the existing work area of the belt sander.
Abstract:
In a recording medium manufacturing method for obtaining a recording medium by effecting a surface smoothing treatment on a surface smoothing treatment surface of a surface of a medium, the surface smoothing treatment surface of the medium is locally pressed by a polishing work tape having a pressure area less than 1 mm, more preferably, less than 0.5 mm with respect to both radial direction and tangential direction relative to rotation of the medium. In a polishing work of recording medium manufacturing process, a problem of occurrence of defects such as scratches on the surface layer can be improved, whereby yield can be increased and mass-productivity can be improved.
Abstract:
The invention relates to a method for improving wear and tear on support bodies (54) for plates or grinding belts in large-scale grinders (1). The support body (54) has a base body (18), onto which an abrasion-resistant primary layer of at least 0.3 mm thickness is applied using a thermal spraying process. This is configured as an inhomogeneous layer with an oxide entrapment of a specific porosity. If the support body (54) is a roll for the forward feed unit (20, 28), the roll body is roughened and a primer and the primary layer are applied using a thermal spraying process. Approximately 50% of the primary layer consists of chromium steel, in particular 13% chromium steel and an abrasion-resistant hard material and said primary layer provides a coarse surface with good grip that is resistant to wear and tear. If the support body (54) is a grinding-belt contact roll (9, 9null), the latter is polished after the thermal spraying process. If the support body (54) is a grinding belt shoe (50), the base body (18) is roughened and an adhesive layer and then the primary layer are applied in a thermal spraying process. The wear-resistant primary layer is polished to create a smooth surface and the layer construction is configured to produce a high degree of slip.
Abstract:
An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding the long material (W) by two or more elastic endless belts (1) with a specified force, rotating the elastic endless belts (1) in the same direction as or in the reverse direction to the moving direction of the long material by moving the long material (W) and increasing or decreasing the rotating speed of the elastic endless belts (1) more than or less than the moving speed of the long material, and loading powder and granular grinding material (S) between the elastic endless belts (1), characterized in that the grinding material (S) is moved relative to the long material (W) to rub the grinding material (S) against the long material (W) so as to finish the surface of the long material (W).
Abstract:
A tensioning assembly for a polishing belt on a linear chemical mechanical polishing apparatus. The tensioning assembly comprises first and second rollers which are operably engaged by respective air cylinders and exert a selected degree of downward tension on the lower run of the horizontal polishing belt. A third roller biased typically by a spring pushes upwardly on the lower run of the belt between the first and second rollers. Accordingly, the first and second rollers, in conjunction with the third roller, tension the belt on the apparatus to maintain optimum material removal rates and uniformity. The degree of tension exerted on the belt can be varied according to stretching of the belt resulting from prolonged use.