发明申请
- 专利标题： Electronic component and method of manufacturing same
- 专利标题（中）： 电子元件及其制造方法
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申请号： US10367344申请日： 2003-02-13
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公开(公告)号： US20040159916A1公开(公告)日： 2004-08-19
- 发明人: Gary Johnson
- 申请人： Motorola, Inc.
- 申请人地址： null
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： null
- 主分类号： H01L023/552
- IPC分类号： H01L023/552
摘要：
An electronic component includes an electronic chip (110) and a chip carrier portion (120) having sidewalls (121) and a bottom portion (122). The electronic chip is mounted over the bottom portion of the chip carrier portion, and the chip carrier portion shields the electronic chip from radiation outside of the electronic component.
公开/授权文献
- US06967390B2 Electronic component and method of manufacturing same 公开/授权日：2005-11-22
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