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发明申请
US20040159967A1 Bubble elimination system for use with stereolithography apparatus and bubble elimination methods 审中-公开
泡沫消除系统用于立体光刻设备和消泡方法

  • 专利标题： Bubble elimination system for use with stereolithography apparatus and bubble elimination methods
  • 专利标题（中）： 泡沫消除系统用于立体光刻设备和消泡方法
  • 申请号： US10705249
    申请日： 2003-11-10
  • 公开(公告)号： US20040159967A1
    公开(公告)日： 2004-08-19
  • 发明人: Warren M. Farnworth
  • 主分类号： B06B001/02
  • IPC分类号： B06B001/02 ;  B29C035/08 ;  B29C041/02 ;  B29C041/50
Bubble elimination system for use with stereolithography apparatus and bubble elimination methods
摘要：
A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substrates, such as semiconductor substrates. A machine vision system with a translatable or locationally fixed camera may be associated with the at least one fabrication site and the material consolidation system. A cleaning component may also be associated with the at least one fabrication site. The cleaning component may share one or more elements with the at least one fabrication site, or may be separate therefrom. The programmed material consolidation apparatus may also include a substrate handling system, which places fabrication substrates at appropriate locations of the programmed material consolidation apparatus.
摘要（中）：

编程材料合并装置包括与所述至少一个制造位置相关联的至少一个制造位置和材料固结系统。 至少一个制造位置可以被配置为接收一个或多个制造衬底，例如半导体衬底。 具有可移动或位置固定的照相机的机器视觉系统可以与至少一个制造场所和材料合并系统相关联。 清洁部件也可以与至少一个制造部位相关联。 清洁部件可以与至少一个制造部位共享一个或多个元件，或者可以与其分开。 编程材料合并装置还可以包括基板处理系统，其将制造基板放置在编程材料固结装置的适当位置。

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