发明申请
- 专利标题： Circuitized substrate and method of making same
- 专利标题（中）： 电路基板及其制作方法
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申请号： US10370529申请日： 2003-02-24
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公开(公告)号： US20040163964A1公开(公告)日： 2004-08-26
- 发明人: Frank D. Egitto , Voya P. Markovich , Thomas R. Miller
- 申请人： Endicott Interconnect Technologies, Inc.
- 申请人地址： NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： NY Endicott
- 主分类号： C25D005/02
- IPC分类号： C25D005/02
摘要：
A method of making a circuitized substrate in which a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like. The structure, including such a chip and circuit board is ideally suited for use within an information handling system.
公开/授权文献
- US06905589B2 Circuitized substrate and method of making same 公开/授权日：2005-06-14
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