- 专利标题： Circuitized substrate assembly and method of making same
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申请号： US10811915申请日： 2004-03-30
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公开(公告)号： US20040177998A1公开(公告)日： 2004-09-16
- 发明人: James W. Fuller JR. , John M. Lauffer , Voya R. Markovich
- 申请人： Endicott Interconnect Technologies, Inc.
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 主分类号： H05K001/11
- IPC分类号： H05K001/11 ; H01R012/04 ; H05K003/30
摘要：
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
公开/授权文献
- US07047630B2 Method of making circuitized substrate assembly 公开/授权日：2006-05-23
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